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Method and application of pica (picosecond imaging circuit analysis) for high current pulsed phenomena

a high-current pulsed, imaging circuit technology, applied in the direction of testing circuits, semiconductor/solid-state device testing/measurement, instruments, etc., can solve the problem of intuitive emission, and achieve the effect of increasing current level and increasing current level

Inactive Publication Date: 2005-10-06
GLOBALFOUNDRIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a method for evaluating high current phenomena such as latchup, ESD, power bus and substrate distribution, and interaction of these in time for dynamic pulses. The method uses a pulse train generated by a high current pulse source to map photon emissions from a device under test. The emissions are detected using a photosensor and data processing is used to relate the emissions to specific features of the device. The method can predict photon emissions and can be used to evaluate the effectiveness of circuit design and to improve the tolerance of high current phenomena. The invention also includes a method for emulating the photon emission visual mapping using a computer aided design system. The technical effects of the invention include improved understanding and evaluation of high current phenomena and the ability to predict and improve the tolerance of high current devices.

Problems solved by technology

A difficulty with this method is that the emissions are not intuitive, and a means to emulate this capability with circuit simulation would be valuable.

Method used

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  • Method and application of pica (picosecond imaging circuit analysis) for high current pulsed phenomena
  • Method and application of pica (picosecond imaging circuit analysis) for high current pulsed phenomena
  • Method and application of pica (picosecond imaging circuit analysis) for high current pulsed phenomena

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Embodiment Construction

[0068] Referring now to the drawings, and more particularly to FIG. 2, a schematic / block diagram is shown of a system 17 including a PICA (Picosecond Imaging Circuit Analysis) tool to which a Transmission Line Pulse (TLP) is supplied in a representative environment on which the subject invention may be implemented in accordance with this invention. The Picosecond Imaging Circuit Analysis (PICA) system 17 includes a PICA imaging system 18 and a PICA timing system 28. A device under test DUT is being examined by the system 17 to achieve evaluation of the latchup condition thereof. The DUT comprises an integrated circuit chip device which is initially in a powered state. A high current pulse source 56 is used, which allows increases in the pulse train magnitude with time. Three tests are evaluated in the process. Those tests relate to the power grid, to the substrate and to the signal pins. The pulse magnitude starts at a low magnitude below the native power supply voltage level.

[0069...

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Abstract

A method, system and apparatus are provided for operating a Picosecond Imaging Circuit Analysis (PICA) / high current source system include applying pulses from a high current pulse source to a Device Under Test (DUT). A photosensor detects photon emissions from the DUT. Signals from the photosensor are used to map photon emissions from the DUT. Data processing means relate the photon emissions to specific features of the DUT.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to picosecond imaging circuit analysis in integrated circuits and, more particularly, to evaluation of latchup, ElectroStatic Discharge (ESD) and power bus robustness in computer chips. [0003] Secondly, this invention relates to an apparatus and a method for a trans-mission line pulse picosecond imaging circuit analysis tool, and more particularly for characterization of pulsed voltage, current, and photon emissions in computer chips. [0004] Thirdly, the present invention relates to the emulation of PICA (Picosecond Imaging Circuit Analysis) in integrated circuits from electrothermal circuit simulation, and more particularly, to evaluation of high current electrothermal phenomena in computer chips. [0005] It is noted that the time scale for the optical measurement may be picoseconds or any other multiple thereof in accordance with this invention. [0006] 2. Description of the Related Art...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G01R31/28G01R31/00G01R31/308G01R31/311G06F17/50H01L21/66
CPCG01R31/308G01R31/00
Inventor SANDA, NAOKO PIAVOLDMAN, STEVEN H.WEGER, ALAN J.
Owner GLOBALFOUNDRIES INC