Dynamic mask module

Abstract

A dynamic mask module is disclosed, which comprises a microcomputer system, a mask pattern generator and a light source. The mask pattern generator is disposed over a substrate and electrically connected to the microcomputer system. The microcomputer system transmits an image signal to the mask pattern generator. The light source is disposed over the mask pattern generator to a photo-resist layer on the substrate. The mask pattern generated by the dynamic mask module is a dynamic image and the mask pattern can be changed on anytime. In addition, the manufacturing cost can be and the manufacturing time can be reduced.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] This application is a divisional of a prior application Ser. No. 10 / 707,628, filed Dec. 25, 2003, which claims the priority benefit of Taiwan application serial no. 92128666, filed Oct. 16, 2003.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a mask module, and more particularly to a dynamic mask module for generating dynamic mask patterns. [0004] 2. Description of the Related Art [0005] During semiconductor fabrication, photolithography is an essential process. Usually, whether a technology is complicate can be determined by the number of the lithographic process and mask. A mask is made from transparent glass and a patterned Cr layer is formed thereon. When a light source is applied thereto, the mask pattern can be transferred to the photo-resist on the substrate. [0006] For high resolution, uniformity of light, stability and quality of mask are key factors thereof. Traditionally, th...

AI Technical Summary

Benefits of technology

The dynamic mask module reduces fabrication costs and time by eliminating the need for multiple masks and alignment steps, enabling efficient transfer of patterns to photo-resist layers and achieving different exposure depths without the use of expensive materials.

Problems solved by technology

The cost of mask depends on the resolution of line width; that is also the main reason that causes the high cost of mask.

Therefore, during the process loading and unloading masks increase process time.

Moreover, traditional gray-level mask uses special and expensive material for obtaining different exposure depths which is also a reason causing high cost of fabrication.

It uses ultraviolet hardening resin via scanning mirror and takes a long time.

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