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Wiring board, method of manufacturing wiring board, and electronic device

a wiring board and electronic device technology, applied in the direction of printed circuit manufacturing, printed circuit aspects, conductive pattern formation, etc., can solve the problem of difficult to use the two materials together

Inactive Publication Date: 2006-01-12
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a wiring board and a method of manufacturing it that allows for the use of a wider variety of conductive and insulating materials. The wiring board has a first wiring layer with high density and is formed by ink jetting a pattern onto a substrate using a photolithography process. An insulating layer is then formed over the first wiring layer using ink jetting to further protect it. A second wiring layer is then formed over the first wiring layer, also using ink jetting. This method allows for the creation of complex wiring patterns and ensures precise placement of the wiring layers.

Problems solved by technology

Consequently, it is difficult to use the two materials together when the heating temperatures at which the conductive material and the insulating material are deposited onto the surface of the substrate are different, or when the curing methods for the two materials, such as with heating and ultraviolet ray irradiation, for example, are different.

Method used

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  • Wiring board, method of manufacturing wiring board, and electronic device
  • Wiring board, method of manufacturing wiring board, and electronic device
  • Wiring board, method of manufacturing wiring board, and electronic device

Examples

Experimental program
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first embodiment

[0047]FIGS. 1 and 2 are cross-sectional views showing the sequence of the method of manufacturing a wiring board having wiring layers 2. FIG. 1 shows the method of forming a wiring layer 2A (first wiring layer) and a wiring layer 2B (second wiring layer), and FIG. 2 shows the method of forming still another wiring layer 2C over the wiring layer 2B. The wiring layer 2A is a high-density wiring layer formed by conventional additive method. The wiring layer 2B and subsequently formed layers are formed by ink jetting in an overlapping fashion partially over the wiring layer 2A. The wiring layer 2A formed by the additive method can have a precision whereby a pattern pitch can be as small as about 40 μm.

[0048] In contrast, the wiring layers 2B and the 2C are formed by an ink jetting method in which a pattern is formed by depositing conductive material as droplets. A far as the pitch patterns are concerned, a resolution of about 200 dpi and the pitch of about 120 μm are achieved with the ...

second embodiment

[0065] Next, another method of forming the layered wiring 2 will be described. The difference between the methods of the first and the second embodiments is in the use of the method of forming the insulating layer 3B shown in FIG. 1(c). The insulating layer 3B of the first embodiment is depressed into a concavity such that the insulating layer 3B encircles the contact sections 2A′ and exposes the contact sections 2A′. When the insulating material is deposited by ink jetting, the concavity must be formed by controlling the depositing so that the insulating material is not applied to the contact sections 2A′. In this case, when non-uniformities occur in the formation of the concavity, the concavity collapses inward and the surface area of the contact sections 2A′ tends to decrease. In this state, it is difficult to form the wiring layer 2B for connecting the contact sections 2A′. In the second embodiment, such non-uniformities are less likely to be caused during the ink jetting.

[0066...

third embodiment

[0094] Next, an embodiment of an electro-optical device having the wiring board 6 of the present invention will be described. FIG. 9 is a plan view of a liquid crystal display device 200, which is an electro-optical device having the wiring board 6. The liquid crystal display device 200 is incorporated into a portable phone or another such electronic device, and is used as a display section. The liquid crystal display device 200 has a liquid crystal panel 201 for displaying various images, and a wiring board 6 provided with a panel control unit for controlling the liquid crystal panel 201. The wiring board 6 has a flexible substrate 1, a terminal 202 for connecting the flexible substrate 1 with an external device, a liquid crystal driver or another such electronic component 5 constituting the panel control unit, and a layered wiring 2 for connecting the electronic component 5 with the terminal 202.

[0095] The liquid crystal display device 200 displays the information inputted from t...

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Abstract

A method of manufacturing a wiring board includes steps of: providing a substrate; forming a first wiring layer on the substrate by photolithography; forming a first insulating layer by ink jetting so as to cover a part of the first wiring layer and expose an exposed section of the first wiring layer; and forming a second wiring layer by ink jetting partly over the first wiring layer, with the first insulating layer being between the part of the first wiring layer and a part of the second wiring layer. A wider variety of conductive material and insulating material can be used for forming the wiring layers and the insulating layers on the substrate by ink jetting, while the wiring board has a first wiring layer having high density.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a wiring board having a wiring layer formed in multiple layers, a method of manufacturing such wiring board, and an electronic device having such wiring board. [0003] 2. Background Information [0004] Conventionally, wiring boards are manufactured by forming a wiring layer and an insulating layer simultaneously on the surface of a substrate. First, droplets of both a conductive material for forming the wiring layer and an insulating material for forming the insulating layer are deposited onto the surface of the substrate by ink jetting. Then, the wiring layer and the insulating layer are formed simultaneously on the surface of the substrate as one layer. Thereafter, another layer of a wiring layer and an insulating layer is formed by similar methods on top of the layer already formed. Thus, a wiring board having multiple layers of the wiring layer is obtained. The wiring layers are el...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K1/00
CPCH05K1/0393H05K3/108H05K3/125H05K3/184H05K3/4664Y10T29/4913H05K2201/09881H05K2203/013Y10T29/49155Y10T29/49124Y10T29/49128H05K3/4685H05K1/02H05K3/10
Inventor IMAI, HIDEOSAKURADA, KAZUAKI
Owner SEIKO EPSON CORP