Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ceramic sprayed member-cleaning method, program for implementing the method, storage medium storing the program, and ceramic sprayed member

a technology of ceramic sprayed member and cleaning method, which is applied in the direction of cleaning using liquids, superimposed coating process, liquid/solution decomposition chemical coating, etc., can solve the problems of abnormal film formation, lowering the operation rate of processing apparatus, and increasing the chamber size, etc., to achieve the effect of reliably suppressing the desorption and attachment of water

Inactive Publication Date: 2006-05-11
TOKYO ELECTRON LTD
View PDF1 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0018] It is an object of the present invention to provide a ceramic sprayed member-cleaning method, and a program for implementing the method, which are capable of reliably suppressing desorption and attachment of water, a storage medium storing the program, and a ceramic sprayed member.
[0042] According to the present invention, the surface of the ceramic sprayed member and water are chemically bonded to each other for stabilization of the water, and water physically adsorbed on the surface of the ceramic sprayed member is desorbed. Thus, when the ceramic sprayed member is used, it is possible to reliably suppress desorption and attachment of water from and to the ceramic sprayed member.
[0043] Further, since the hydration processing is carried out by exposing the ceramic sprayed member to a high-pressure, high-humidity, and high-temperature environment, it is possible to further stabilize water chemically bonded to the surface of the ceramic sprayed member, thereby more reliably suppressing desorption and attachment of water from and to the ceramic sprayed member.
[0044] Furthermore, since the ceramic sprayed member is heated, desorption of water physically adsorbed on the surface of the ceramic sprayed member can be promoted, which makes it possible to reliably suppress desorption and attachment of water from and to the ceramic sprayed member when the ceramic sprayed member is used.

Problems solved by technology

Desorption and attachment of water from and to the inner wall of the chamber can cause problems, such as an increase in chamber-evacuating time, which results in lowering of the operation rate of the processing apparatus, abnormal film formation in forming a metal film, instability of the etching rate in etching an oxide film or the like, separation of particles, and abnormal discharge in generating plasma.
However, in any of the proposed apparatuses, in the case where a member having ceramic thermally sprayed on a surface thereof is used in the chamber, the effect of removing water is limited, so that it is impossible to reliably suppress desorption and attachment of water from and to the ceramic sprayed member.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ceramic sprayed member-cleaning method, program for implementing the method, storage medium storing the program, and ceramic sprayed member
  • Ceramic sprayed member-cleaning method, program for implementing the method, storage medium storing the program, and ceramic sprayed member
  • Ceramic sprayed member-cleaning method, program for implementing the method, storage medium storing the program, and ceramic sprayed member

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051] The present invention will now be described in detail with reference to the drawings showing a preferred embodiment thereof.

[0052]FIG. 1 is a cross-sectional view schematically showing the construction of a plasma processing apparatus in which is used a ceramic sprayed member according to an embodiment of the present invention.

[0053] Referring to FIG. 1, the plasma processing apparatus 1 as an etching apparatus for carrying out etching on wafers has formed therein a cylindrical chamber (processing chamber) 10 formed of metal, e.g. aluminum or stainless steel. Disposed within the chamber 10 is a cylindrical susceptor 11 on which is placed a wafer W having a diameter e.g. of 300 mm.

[0054] Formed between an inner side wall of the chamber 10 and the susceptor 11 is an exhaust passage 12 functioning as a flow path for discharging a gas above the susceptor 11 out of the chamber 10. An annular baffle plate 13 is disposed in an intermediate portion of the exhaust passage 12. A por...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
pressureaaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

A ceramic sprayed member-cleaning method which is capable of reliably suppressing desorption and attachment of water. The surface of a ceramic sprayed member and water are chemically bonded to each other, whereby the water is stabilized. Water physically adsorbed on the surface of the ceramic sprayed member is desorbed.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a ceramic sprayed member-cleaning method, a program for implementing the method, a storage medium storing the program, and a ceramic sprayed member, and more particularly to a ceramic sprayed member-cleaning method for cleaning ceramic sprayed members, such as an electrode, a focus ring, and an electrostatic chuck, which are used in a chamber in which a plasma atmosphere is formed by a processing gas, and a conveying arm used in a conveyor for conveying substrates and the like to a processing apparatus, a program for implementing the method, a storage medium storing the program, and a ceramic sprayed member. [0003] 2. Description of the Related Art [0004] Conventionally, a plasma processing apparatus that carries out predetermined plasma processing on a substrate such as a semiconductor wafer generally includes a chamber for housing the substrate. In such processing apparatus, member...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B05D3/02B32B15/00
CPCB08B1/00B08B3/08B08B3/12B08B5/02Y10T428/12771C23C4/10C23C4/18Y10T428/12667B08B7/00B08B1/14
Inventor MORIYA, TSUYOSHIMITSUHASHI, KOUJI
Owner TOKYO ELECTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products