Pattern forming method and wiring pattern forming method, and electro-optic device and electronic equipment
Patent Information
- Authority / Receiving Office
- US ยท United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- SEIKO EPSON CORP
- Publication Date
- 2007-01-11
- Estimated Expiration
- Not applicable ยท inactive patent
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Abstract
Description
[0001] This is a Divisional of application Ser. No. 10 / 898,344 filed Jul. 26, 2004. The entire disclosure of the prior applications is hereby incorporated by reference herein in its entirety.BACKGROUND OF THE INVENTION
[0002] 1. Field of Invention
[0003] The present invention relates to a pattern forming method for forming a thin film pattern on a base material and a forming method of a wiring pattern using the thin film pattern, and an electro-optic device and electronic equipment.
[0004] 2. Description of Related Art
[0005] Conventionally, as a manufacturing method of a device having a fine wiring pattern such as a semiconductor integrated circuit, a photolithography method is often used, however a device manufacturing method using a droplet discharging method (ink jet method) has attracted attention. There is proposed a method in which in the case where the fine wiring pattern is formed using the droplet discharging method, in order to increase precision in a pattern line width, ...