Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Surface treating solution for fine processing of glass base plate having a plurality of components

a technology of surface treatment solution and glass base plate, which is applied in the direction of surface treatment composition, chemical apparatus and processes, etc., can solve the problems of local variation in etching rate and etching amount, mechanical thinning of mother glass plate, and interference with uniform etching/cleaning

Inactive Publication Date: 2007-02-08
KIKUYAMA HIROHISA +3
View PDF3 Cites 58 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a surface treatment solution for finely processing glass substrates containing multiple ingredients, such as HF, NH4F, and an acid with a larger dissociation constant than HF. The solution contains at least one acid with a larger dissociation constant than HF, which prevents crystal precipitation and surface roughness when etching the glass substrate. The concentration of the acid in the solution is adjusted to inhibit crystal precipitation and achieve a smooth surface. The solution can be used for finely processing glass substrates used in LC-based or organic EL-based flat panel display devices."

Problems solved by technology

However, the mechanical thinning of a mother glass plate has a limitation, because a mother glass plate must have strength sufficiently high enough to withstand stresses imposed during the thinning process.
However, if a coarse glass substrate containing multiple ingredients, particularly cation-yielding elements and their oxides, is etched / cleaned by means of a conventional etching solution comprising HF or BHF, following two problems are encountered which interfere with the uniform etching / cleaning.
The problem 2) was ascribed to that crystals developed on the surface of a glass substrate and adhered thereto interfere with etching and / or that cation-yielding elements and their oxides contained in a glass substrate are differently susceptible to etching, which causes the local variation in etching rate and etching amount.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface treating solution for fine processing of glass base plate having a plurality of components
  • Surface treating solution for fine processing of glass base plate having a plurality of components
  • Surface treating solution for fine processing of glass base plate having a plurality of components

Examples

Experimental program
Comparison scheme
Effect test

examples

[0069] The method of the invention will be described below more specifically by means of examples. However, the present invention is not limited to those examples.

[0070] First, as a fundamental experiment, hydrochloric acid (HCl)-added BHF-based etching solutions were prepared with the concentration of HCl being varied. The compositions of the etching solutions and their features are summarized in Table 1 below.

TABLE 1Rate ofetching ofHFHydrochloricglass(mol / NH4Facidsubstratekg)(mol / kg)(mol / kg)(23° C.)(Å / min)Features0.510.2514400.52260Rate of etching ofheated oxide filmmaximum1.2538202.55000Rate of etching ofheated oxide filmminimum3.256120131305026700Rate of etching ofheated oxide filmmaximum39580412910Rate of etching ofheated oxide filmminimum515560330.542301.58090Rate of etching ofheated oxide filmmaximum2.7513640421060Rate of etching ofheated oxide filmminimum4.522780540.583101.514480Rate of etching ofheated oxide filmmaximum2.2518480425200

[0071] The glass substrate used in t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
concentrationaaaaaaaaaa
dissociation constantaaaaaaaaaa
Login to View More

Abstract

A surface treatment solution for finely processing a glass substrate containing multiple ingredients is used for the construction of liquid crystal-based or organic electroluminescence-based flat panel display devices without invoking crystal precipitation and / or increasing surface roughness. An etching solution of the invention contains, in addition to hydrofluoric acid (HF) and ammonium fluoride (NH4F), at least one acid whose dissociation constant is larger than that of HF. The concentration of the acid in the solution can advantageously be adjusted to maximize the etching rate.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a surface treatment solution for finely processing the surface of a glass substrate containing multiple ingredients. More specifically, the present invention relates to a surface treatment solution, useful for the fine surface processing of glass substrates, containing cation-yielding elements and their cation-yielding oxides, which is very profitably used for wet-etching / cleaning the surface of such glass substrates or etching / cleaning the surface of such glass substrates carrying finely fabricated semiconductor elements thereon during the fabrication of semiconductor devices. [0003] 2. Related Art [0004] In the wet processing of glass panels for flat panel display devices, pattern-etching / cleaning of glass substrates containing cation-yielding elements and their cation-yielding oxides and purification / fine-processing of pattern-etched such glass substrates using an etching solution...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): C09K13/00C03C15/00
CPCC03C15/00C09K13/08
Inventor KIKUYAMA, HIROHISAYABUNE, TATSUHIROMIYASHITA, MASAYUKIOHMI
Owner KIKUYAMA HIROHISA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products