Resin composition for insulating layer for multi-layered printed board

Abstract

Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups) / (the total number of benzene rings)), P, satisfies the equation 0<P<1; (C) a phenoxy resin; and (D) rubber particles, are suitable for use as an insulating layer of a multi-layered printed board in which, in spite of the fact that the roughness of a roughened surface after a roughening treatment is relatively small, an insulating layer having a good tight adhesion with a conductor layer formed by plating is able to be easily introduced into a multi-layered printed board.

Description

CROSS REFERENCES TO RELATED APPLICATIONS [0001] This application claims priority to Japanese Patent Application No. 344686 / 2005, filed on Nov. 29, 2005, and Japanese Patent Application No. 045637 / 2006, filed on Feb. 22, 2006, both of which are incorporated herein by reference in their entireties. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to epoxy resin compositions which are suitable for the formation of insulating layers for multi-layered printed boards. [0004] 2. Discussion of the Background [0005] In recent years, a tendency of making electronic instruments small in size and highly efficient is increasing and, in a multi-layered printed board, a build-up layer is made into multi-layered, and a tendency of making the wiring finer and more dense is also further increasing. With regard to a method for the formation of a conductor layer suitable for the formation of fine wiring of high density, there have been known an additive ...

AI Technical Summary

Benefits of technology

[0012] Accordingly, it is one object of the present invention to provide novel epoxy resin compositions which are suitable for use as an insulating layer of a multi-layered printed board.

[0013] It is another object of the present invention to provide novel epoxy resin compositions which are suitable for use as an insulating layer of a multi-layered printed board in which, in spite of the fact that the roughness of a roughened surface after a roughening treatment is relatively small, there is provided an epoxy resin composition in which the roughened surface is able to achieve an insulating layer (interlayer insulating layer) showing a high adhesiveness to a plated conductor.

[0043] In accordance with the present invention, it is now possible that, in spite of the fact that the roughness of a roughened surface after a roughening treatment is relatively small, an insulating layer having a good tight adhesion with a conductor layer formed by plating is able to be easily introduced into a multi-layered printed board. Thus, when an insulating layer comprising the cured product of the resin composition of the present invention is introduced to manufacture a multi-layered printed board, a plated conductor (conductor layer) is able to be held with a high adhesive force in spite of the fact that the roughened surface prepared by a roughening treatment of an insulating layer with an oxidizing agent has a relatively lower roughness and, as a result, a flash etching upon finishing a wiring formation by removal of the unnecessary part of the plated conductor layer by means of flash etching is able to be carried out within short time. Accordingly, it is now possible that a high-density wiring having a highly reliable adherence to an insulating layer with a high adhesive force (peel strength) and having neither damage nor cutting is able to be formed with a high reproducibility.

Problems solved by technology

On the other hand, if a flash etching is carried out for long time, in consequence of that, a risk of damaging or cutting fine wiring becomes high.

However, up to now, no insulating material which is able to form a rough surface having such a property has been developed.

However, even in those Patent Documents which disclose various kinds of resin compositions as such, there is no disclosure of a resin composition which gives a low roughness and high peel strength for using as an insulating layer and there is no indication therein for such a problem to be solved.

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