Rolling mold for microstructured film imprinting

a microstructured film and mold technology, applied in the field of imprint technology, can solve the problems of microstructure damage, difficult fabrication of integrated circuits of a smaller size, restricted integration circuit fabrication, etc., and achieve the effects of high hardness, simple and easy operation, and flexible position adjustmen
US20070271791A1Inactive Publication Date: 2007-11-29IND TECH RES INST
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
IND TECH RES INST
Publication Date
2007-11-29
Estimated Expiration
Not applicable · inactive patent

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Abstract

A rolling mold for microstructured film imprinting includes a roller and a filmed metal template. The roller has a round outer surface. The filmed metal template is disposed with a microstructured film imprint pattern and changeably coupled to the roller by magnetic force or vacuum suction. Rolling of the roller allows the microstructured film imprint pattern to form a microstructured film, thus solving the drawbacks of the prior art.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an imprint technology, and more particularly to a rolling mold for microstructured film imprinting.

[0003] 2. Description of Related Art

[0004] As the line width of an integrated circuit becomes increasingly narrower and traditional photolithography technologies are used for fabrications, the integrated circuit fabrication is restricted by the diffraction of light if the line width of an integrated circuit is smaller than the wavelength of the light; for instance, the fabrication of integrated circuits of a smaller size will be very difficult when the line width is below 100 nanometers. A research conducted by Stephen Y. Chou of Princeton University pioneered the nano-imprint lithography (NIL) imprints a pattern having a line width less than 10 nm by high temperature and high pressure, and its related technology has been disclosed in U.S. Pat. No. 5,772,905.

[0005] Thereafter, a step and stamp...

Claims

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