Slurry for CMP of Cu film, polishing method and method for manufacturing semiconductor device

a technology of polishing method and cu film, which is applied in the direction of manufacturing tools, lapping machines, other chemical processes, etc., can solve the problems of increasing the quantity of polishing in the second polishing, increasing the difficulty of minimizing the dishing or corrosion of cu film, and increasing the difficulty of cu film corrosion

Inactive Publication Date: 2007-12-20
KK TOSHIBA
View PDF4 Cites 44 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since it is expected in future that the thickness of barrier metal becomes increasingly thinner and the polishing quantity in the second polishing is increasingly reduced, it would become more difficult to sufficiently minimize the dishing or corrosion of Cu film even if a conventional slurry containing peroxosulfate is employed.
Namely, although it is now desired to polish the Cu film at a high rate while making it possible to obviat

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Slurry for CMP of Cu film, polishing method and method for manufacturing semiconductor device
  • Slurry for CMP of Cu film, polishing method and method for manufacturing semiconductor device
  • Slurry for CMP of Cu film, polishing method and method for manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

embodiment 1

[0054] Embodiment 1 will be explained with reference to FIGS. 1 and 2.

[0055] First of all, as shown in FIG. 1, an insulating film 11 formed of SiO2 was deposited on a semiconductor substrate 10 having semiconductor elements (not shown) formed therein and then a plug 13 was formed in the insulating film 11 with a barrier metal 12 being interposed therebetween. The barrier metal 12 was formed by TiN, and the plug 13 was formed by W. Then, a low dielectric constant insulating film 14 was deposited all over the resultant surface.

[0056] The low dielectric constant insulating film 14 can be formed by at least one insulating material selected, for example, from the group consisting of SiC, SiCH, SiCN, SiOC and SiOCH. In this embodiment, the low dielectric constant insulating film 14 was formed by SiOC.

[0057] Then, a wiring trench “A” having a width of 60 nm was formed as a recess in the low dielectric constant insulating film 14. Thereafter, a Ti film having a thickness of 2 nm and func...

embodiment 2

[0103] A structure as shown in FIG. 1 was obtained, wherein the width and intervals of the wiring trench “A” were both set to 65 nm. In this embodiment, in order to investigate the influence of the short by the residue of Cu, a barrier metal 15 was formed by a Ta film having a thickness of 15 nm. The Cu film 16 was removed by CMP to expose the surface of the barrier metal 15. As the slurry, the samples of Nos. 4, 8, 14, 2, 20, 31 and 39 were employed for performing the CMP under the same conditions as in the case of Embodiment 1.

[0104] The surface of the Cu film was observed using a defective-evaluating apparatus (KLA; Tenchol Co., Ltd.) and evaluated based on the existence or non-existence of Cu residue per cm2 according to the following criterions.

[0105]◯: There was no Cu residue

[0106]×: Existence of Cu residue was confirmed

[0107] The results obtained from each of these slurries are summarized in the following Table 13.

[0108] Then, the kind of slurry was changed and CMP was r...

embodiment 3

[0122] On the occasion of forming a trench to be filled with a Cu film by the RIE work in an insulating film having a relative dielectric constant of 3 or less, a mask material constituted by an insulating film made of SiN or SiO2 is employed. In this case, the RIE selectivity ratio would be around 5. When a metal film is employed as a mask material, the RIE selectivity ratio can be enhanced to 10 or more. In this case, since the thin film of mask material can be further made thinner, it is advantageous in the fine working thereof. With respect to the polishing rate on the occasion of the CMP of Cu film, a metal film can be polished at a higher rate as compared with an insulating film such as SiN or SiO2, the metal film can be easily removed. Because of this, it is possible, through the employment of a metal film as a mask material, to perform the polishing which makes it possible to reduce the polishing load and the concentration of abrasive grains and to minimize the mechanical st...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Speedaaaaaaaaaa
Speedaaaaaaaaaa
Login to view more

Abstract

A slurry for CMP of Cu film is provided, which includes water, peroxosulfuric acid or a salt thereof, basic amino acid, a complexing agent which forms a water-insoluble metal complex, a surfactant, and colloidal silica having a primary diameter ranging from 5 to 50 nm. The basic amino acid is included at a content of 0.05 to 0.5 wt %.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2006-170224, filed Jun. 20, 2006, the entire contents of which are incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] This invention relates to a slurry for CMP of Cu film, to a polishing method, and to a method of manufacturing a semiconductor device. [0004] 2. Description of the Related Art [0005] The Cu damascene wiring to be mounted on a high-performance LSI is generally formed by CMP. In this CMP, a Cu film is removed at first in a first polishing and then redundant portions of metal and insulating film are removed in a second polishing. In order to shorten the processing time, the first polishing should desirably be performed as high rate as possible. Accordingly, the Cu film is increasingly demanded to be capable of meeting the requirement of high polishing rate. In this c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/461H01L21/302C03C15/00B24B37/00B82Y10/00B82Y99/00C09K3/14H01L21/304
CPCC09G1/02H01L21/7684H01L21/3212C09K3/1463
Inventor MINAMIHABA, GAKUFUKUSHIMA, DAIYANO, HIROYUKI
Owner KK TOSHIBA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap