Modular Thermal Management System for Spacecraft

Abstract

A composite panel provides structural strength and rigidity for modular assembly of spacecraft while serving the dual purposes of structure and heat transfer for thermal management of an environment for equipment, such as a spacecraft. Instruments, gimbals, surveillance, imaging, detectors, and the like may be mounted in a spacecraft designed and constructed from standard panels to provide the structural and heat transfer requirements to support the onboard equipment. Extremely small temperature differentials required by the panels support a substantially isothermal perimeter for the structure, able to sink heat from any location on a panel, transport it to a rejection site, and reject it to the cold environment of space, thus easing the task of design and packaging of instrumentation and infrastructure of satellites and other spacecraft. Two-phase mass transport of fluids inside the panels aids high heat flux rates with minimal temperature differentials, even with reinforced, composite, polymeric materials for the structural elements of the panels.

Description

RELATED APPLICATIONS[0001]This application: (1) is a continuation-in-part of co-pending U.S. patent application Ser. No. 11 / 743,555, filed on May 2, 2007; (2) claims the benefit of co-pending U.S. Provisional Patent Application Ser. No. 60 / 954,550, filed on Aug. 7, 2007; and (3) claims the benefit of co-pending U.S. Provisional Patent Application Ser. No. 61 / 042,205, filed on Apr. 3, 2008.BACKGROUND[0002]1. The Field of the Invention[0003]This invention relates to heat transfer and, more particularly, to novel systems and methods for combined structural and heat transfer panels for spacecraft.[0004]2. The Background Art[0005]Heat transfer is fundamental to many processes. Engines releasing energy from fuel must routinely reject heat. Meanwhile, electrical and electronic devices that consume electricity likewise require cooling. One particularly demanding environment occurs with spacecraft. Spacecraft contain many electronic instruments. Weight is at a premium, as is space. Meanwhile...

AI Technical Summary

Benefits of technology

[0011]For example, temperature differentials ranging from tens to hundreds of degrees exist to drive heat in various heat transfer mechanisms and devices. By contrast, panels in accordance with the invention may maintain temperature differentials of as little as two degrees Fahrenheit or less between a heat sink location receiving heat from a device mounted thereto and a location of heat rejection by the panel to the environment. Thus, individual panels may be capable of maintaining a temperature throughout within such a narrow limit. Meanwhile, whether or not a particular panel is viewing the sun or black space, interconnected panels may stabilize and reduce temperature differentials while efficiently moving heat about the connected system of panels.

[0032]Detectors, such as surveillance instruments may have greater “time on target” because they need not be so sensitive to solar radiation. Whether shielded by selectively openable and closeable doors, or simply relying on a substantially isothermal belt carrying heat from a heated region to a cold, heat-rejecting region of the paneled box, potential heat loads may be rejected from the satellite or other spacecraft by radiating from fixed, door, or both panels viewing space from the shadowed or shaded side of a spacecraft. Addition of reflective doors or surfaces may simply augment this reduction of solar load and reduce the requirement for heat rejection required for a spacecraft.

Problems solved by technology

Meanwhile, electrical and electronic devices that consume electricity likewise require cooling.

One particularly demanding environment occurs with spacecraft.

Meanwhile, the loads required of any structure during launch may be substantial.

Thus, the combination of light weight and high strength is difficult to achieve.

By contrast, composite materials such as bonded composites, fiber-reinforced layers, and the like typically have comparatively poor thermal conductivity.

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