Structure and Method of Sub-Gate NAND Memory with Bandgap Engineered SONOS Devices

Abstract

A bandgap engineered SONOS device structure for design with various AND architectures. The BE-SONOS device structure comprises a spacer oxide disposed between a control gate overlaying an oxide-nitride-oxide-nitride-oxide stack and a sub-gate overlaying a gate oxide. In one example, a BE-SONOS sub-gate-AND array architecture has multiple strings of SONONOS devices with sub-gate lines and diffusion bit lines. In another example, a BE-SONOS sub-gate-AND architecture has multiple strings of SONONOS devices with sub-gate lines, relying on the sub-gate lines that create inversions to substitute for the diffusion bit lines.

Description

RELATED APPLICATIONS[0001]This application is a continuation-in-part of U.S. application Ser. No. 11 / 419,977, filed 23 May 2006 by inventors Hang-Ting Lue and Hao Ming Lien entitled Structure and Method of Sub-Gate and Architectures Employing Bandgap Engineered SONOS Devices. This application is incorporated herein by reference.[0002]This application claims the benefit of U.S. Provisional Patent Application No. 60 / 968,076, filed on 27 Aug. 2007, and claims the benefit of U.S. Provisional Patent Application No. 61 / 019,178, filed on 4 Jan. 2008, each of which is incorporated by reference as if fully set forth herein.BACKGROUND OF THE INVENTION[0003]1. Field of the Invention[0004]The present invention relates generally to non-volatile memory devices, and more particularly, to nitride-based NAND memories.[0005]2. Description of Related Art[0006]Electrically programmable and erasable non-volatile memory technologies based on charge storage structures known as Electrically Erasable Progra...

AI Technical Summary

Benefits of technology

[0017]Various embodiments of the present technology provide greater scalability over floating gate AND-type memory devices, provide a uniform and self-converging hole tunneling erase operation, eliminate the inter-floating gate coupling effect, excellent charge retention, and / or small degradation despite numerous after program and erase cycles.

Problems solved by technology

However, the hot hole injection causes oxide damage, leading to charge loss in the high threshold cell and charge gain in the low threshold cell.

This difference in erase speed results in a large Vt distribution of the erase state, where some of the cells become hard to erase and some of them are over-erased.

Thus the target threshold Vt window is closed after many program and erase cycles and poor endurance is observed.

This phenomenon will become more serious when the technology keeps scaling down.

Floating gate devices encounter substantial scaling challenges due to inter-floating gate coupling.

Some nitride trapping device include: one that stores charges locally and is sensitive to hot-hole induced damages, and SONOS that uses channel program / erase and suffers from retention problems caused by direct tunneling leakage through the thin tunnel oxide.

However, due to the inter-floating gate coupling effect, the scaling of NAND-type floating gate devices is limited.

When the space parameter for the floating gate device is shrunk, a high floating gate coupling effect may cause undesirable and severe disturbance.

The conventional NAND-type floating gate device also suffers from tunnel oxide scaling issues and erratic bits where a local defect, or trapped charge, in a tunnel oxide can result in the leakage of the charge in the floating gate.

However, these devices all suffer serious charge retention problems.

For a SONOS device, the ultra-thin tunnel oxide is unable to properly preserve a charge storage.

For a MNOS device, the structure does not provide a top oxide to block the charge loss.

A nano-crystal device cannot be well-controlled because of the randomly distributed nano particles.

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