Integrated Circuit Package Contact Cleaning

Inactive Publication Date: 2009-07-02
TEXAS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010]The invention has advantages including but not limited to one or more of; improvements in manufacturing output and test quality, integration of cleaning with other processes, reduced processing time, higher yields, and reduced cost. These and other features, advantages, and benefits of the present invention can be understood by one of ordinary skill in the arts upon careful consideration of the detailed description of representative embodiments of the invention in connection with the accompanying drawings.

Problems solved by technology

However, for many packages, for example, those employing leads plated with a combination of nickel, palladium, and gold (NiPdAu), there is no flawless deflashing process known in the arts.
In the event the contacts are not sufficiently cleaned, the presence of contaminants on the contacts can cause problems with final testing or use due to interfering with necessary electrical contact between the leads or contact pads and test probes.

Method used

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  • Integrated Circuit Package Contact Cleaning
  • Integrated Circuit Package Contact Cleaning
  • Integrated Circuit Package Contact Cleaning

Examples

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Embodiment Construction

[0018]While the making and using of various exemplary embodiments of the present invention are discussed herein, it should be appreciated that the present invention provides inventive concepts which can be embodied in a wide variety of specific contexts. It should be understood that the invention may be practiced with semiconductor device package handling and transfer methods and mechanisms of various types, configurations, and materials without altering the principles of the invention. For purposes of clarity, detailed descriptions of functions and systems familiar to those skilled in the semiconductor manufacturing equipment and processing arts are not included. In general, the invention provides apparatus and methods for cleaning electrical contacts on integrated circuit packages.

[0019]A system for cleaning semiconductor device package contacts according to preferred embodiments of the invention is illustrated in the perspective view of FIG. 1. The cleaning system 10 may be used ...

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Abstract

The invention provides methods and apparatus for automated contamination removal in association with integrated circuit manufacturing and testing. Disclosed embodiments include methods for cleaning electrical contacts of integrated circuit packages with steps for transporting the package from a first position to a second position and, during the transit, bringing the electrical contacts into engagement with one or more cleaning station. Aspects of the disclosed apparatus include a package transit chute for moving packages from a first position to a second position and one or more cleaning stations between the first and second positions. The cleaning stations further include one or more cleaning mats positioned for cleaning electrical contacts of packages transported in the chute.

Description

TECHNICAL FIELD[0001]The invention relates to electronic semiconductor devices and manufacturing. More particularly, the invention relates to apparatus and methods for cleaning packaged microelectronic integrated circuit (IC) assemblies in association with manufacturing processes.BACKGROUND OF THE INVENTION[0002]Generally speaking, semiconductor devices such as integrated circuits (ICs) are manufactured by forming layered metallic circuit components and patterns on a semiconductor wafer. Numerous such ICs are formed on a single wafer. The individual ICs are separated from one another by a singulation process, such as sawing. Each IC is typically mounted on a metallic leadframe, and the IC-leadframe assembly is then encapsulated within a package. Package material, or “encapsulant” is commonly made from viscous or semi-viscous plastic or epoxy resin, which is cured to form a hardened protective cover to shield the protect the IC assembly from environmental hazards such as dust, heat, ...

Claims

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Application Information

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IPC IPC(8): B24B1/00
CPCH01L21/67028
InventorLEE, C.C.YU, LEOWANG, W.L.CHUI, TSER-TSUNLIAO, C.S.CHANG, WADE
OwnerTEXAS INSTR INC