Techniques for Mounting a Millimeter Wave Antenna and a Radio Frequency Integrated Circuit Onto a PCB

Abstract

A printed circuit board (PCB) assembled to include at least one millimeter wave antenna and a radio frequency integrated circuit (RF IC). The PCB comprises a square-shaped cavity in the PCB, wherein one of the edges of the cavity is substantially parallel to connecting pins of the at least one millimeter wave antenna; a RF IC placed in the cavity, wherein one side of the RF IC including RF pads is substantially at the edge of the cavity that is substantially parallel to the connecting pins; and traces connecting the RF pads and the connecting pins, wherein the connection between the at least one millimeter wave antenna and the RF IC shortens the length of the traces.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of U.S. provisional application No. 61 / 086,924 filed on Aug. 7, 2008, the contents of which are herein incorporated by reference.TECHNICAL FIELD[0002]The present invention relates generally to radio frequency integrated circuits, and particularly to connecting radio frequency integrated circuits to millimeter wave antennas.BACKGROUND OF THE INVENTION[0003]The 60 Giga Hertz (GHz) band is an unlicensed band which features a large amount of bandwidth allowing a very high volume of information to be transmitted wirelessly. As a result, multiple applications, that require transmission of a large amount of data, can be developed to allow wireless communication around the 60 GHz band. Examples for such applications include, but are not limited to, a wireless high definition TV (HDTV), a wireless docking station, a wireless Gigabit Ethernet, and many others.[0004]In order to facilitate such applications there is...

AI Technical Summary

Benefits of technology

[0017]Certain embodiments of the invention include a printed circuit board (PCB) assembled to include at least one millimeter wave antenna and a radio frequency integrated circuit (RF IC). The PCB comprises a square-shaped cavity in the PCB, wherein one of the edges of the cavity is substantially parallel to connecting pins of the at least one millimeter wave antenna; a RF IC placed in the cavity, wherein one side of the RF IC including RF pads is substantially at the edge of the cavity that is substantially parallel to the connecting pins; and traces connecting the RF pads and the connecting pins, wherein the connection between the at least one millimeter wave antenna and the RF IC shortens the length of the traces.

Problems solved by technology

Most of the energy is lost due to the connection between an antenna and an integrated circuit (IC), or chip, processing the RF signals to be transmitted or received.

In addition, the antenna 100 does not provide spectrum coverage of 360 degrees.

The on-chip dipole antenna 100 is not feasible for commercial uses due to its inefficiency.

This is due to the substrate and connection losses.

However, the LTCC process is very costly, and therefore is not feasible for commercial uses.

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