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Liquid-cooling type thermal module

a thermal module and liquid cooling technology, applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of limited heat dissipation effect, large amount of heat produced by electronic elements inside electronic devices, and large amount of heat produced by electronic devices during operation, so as to achieve effective removal of heat produced by heat-producing elements, simple structure, and easy assembly

Inactive Publication Date: 2010-04-15
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a liquid-cooling type thermal module that has a simple structure, eliminates the problem of fluid leak, and is easy to assemble. The module includes a liquid cooling unit and at least one heat pipe that connects the heat-producing element to the cooling unit. The heat pipe absorbs the heat produced by the element and transfers it to the remote end for dissipation, preventing heat accumulation in the system. The thermal module provides excellent heat dissipating effect.

Problems solved by technology

While an electronic device operates at constantly increased high speed, electronic elements inside the electronic device also produce a large amount of heat during the operation thereof.
However, the heat sink or the radiating fin assembly can only radiates heat and provides very limited heat-dissipating effect.
However, since joints between the internal components of the electronic device are not always watertight, the fluid tends to leak to cause damage to the electronic device.
Moreover, the components of the conventional water-cooling type thermal module 1 are complicate to occupy a large room and can not be easily installed.
Therefore, the conventional thermal module 1 requires a relatively high manufacturing cost.
In conclusion, the conventional water-cooling thermal module has the following disadvantages: (1) having complicated components; (2) uneasy to install; (3) being subject to water leak; (4) occupying a relatively large room; and (5) requiring relatively high manufacturing cost.

Method used

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first embodiment

[0015]Please refer to FIGS. 2 and 3. A liquid-cooling type thermal module according to the present invention includes a liquid cooling unit 2 and at least one heat pipe 3. The heat pipe 3 has a heat-absorbing end 31 and a heat-dissipating end 32. The heat-absorbing end 31 has a flat configuration and is connected to and bearing on at least one heat-producing element 41. The heat-producing element 41 is located inside a system 4 while the liquid cooling unit 2 is located outside the system 4. The heat pipe 3 is extended from the liquid cooling unit 2 into the system 4 with the heat-absorbing end 31 bearing on the heat-producing element 41 and the heat-dissipating end 32 connected to the liquid cooling unit 2. Heat produced by the heat-producing element 41 is absorbed by the heat pipe 3 at the heat-absorbing end 31 and then transferred via the heat-dissipating end 32 to the liquid cooling unit 2, and is finally dissipated into ambient air. Since the heat pipe 3 is able to absorb and e...

second embodiment

[0018]In the second embodiment, the heat pipe 3 also has a heat-absorbing end 31 and a heat-dissipating end 32. The heat-absorbing end 31 is bearing on the heat-producing element 41. When the heat-producing element 41 produces heat, the heat-absorbing end 31 of the heat pipe 3 absorbs and transfers the produced heat to the remote heat-dissipating end 32. The heat-dissipating end 32 is inserted into the dissipating space 23 of the liquid cooling unit 2, which is located outside the system 4, so that the fluid in the dissipating space 23 can cool the heat-dissipating end 32 to achieve the purpose of dissipating heat.

[0019]In the present invention, by using the heat pipe 3 as a medium for conducting heat, the heat produced by the heat-producing element 41 can be exactly transferred to an outer side of the system 4 without accumulating therein. Moreover, with the heat pipe 3 being used as the medium of conducting heat, the problem of fluid leak is eliminated and damage to electronic com...

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Abstract

A liquid-cooling type thermal module includes a liquid cooling unit and at least one heat pipe. The heat pipe has a heat-absorbing end and a heat-dissipating end. The heat-absorbing end is connected to at least one heat-producing element. The heat-producing element is located inside a system while the liquid cooling unit is located outside the system. The heat pipe connects the heat-producing element to the liquid cooling unit. Heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred to the remote liquid cooling unit via the heat-dissipating end to be dissipated. With the heat pipe being used as a medium for conducting heat, the problem of fluid leak can be eliminated, and the heat produced by the heat-producing element can be effectively carried away from the system without stagnating around the heat-producing element, enabling the thermal module to provide excellent heat dissipating effect.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a liquid-cooling type thermal module, and more particularly to a thermal module that employs a heat pipe as a heat conducting medium and uses a liquid cooling unit to cool the heat pipe and dissipate heat.BACKGROUND OF THE INVENTION[0002]While an electronic device operates at constantly increased high speed, electronic elements inside the electronic device also produce a large amount of heat during the operation thereof. In general, a heat sink or a radiating fin assembly is arranged on the electronic elements to provide increased heat-dissipating area and thereby enhanced heat-dissipating efficiency. However, the heat sink or the radiating fin assembly can only radiates heat and provides very limited heat-dissipating effect. In order to solve the above problem, liquid-cooling type thermal modules have been developed for providing better heat-dissipating effect.[0003]Please refer to FIG. 1, which shows a conventional water...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28D15/00
CPCF28D15/00F28D15/0266H01L23/473H01L2924/0002H01L2924/00
Inventor CHEN, CHIH-PENG
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD