Liquid-cooling type thermal module
a thermal module and liquid cooling technology, applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of limited heat dissipation effect, large amount of heat produced by electronic elements inside electronic devices, and large amount of heat produced by electronic devices during operation, so as to achieve effective removal of heat produced by heat-producing elements, simple structure, and easy assembly
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first embodiment
[0015]Please refer to FIGS. 2 and 3. A liquid-cooling type thermal module according to the present invention includes a liquid cooling unit 2 and at least one heat pipe 3. The heat pipe 3 has a heat-absorbing end 31 and a heat-dissipating end 32. The heat-absorbing end 31 has a flat configuration and is connected to and bearing on at least one heat-producing element 41. The heat-producing element 41 is located inside a system 4 while the liquid cooling unit 2 is located outside the system 4. The heat pipe 3 is extended from the liquid cooling unit 2 into the system 4 with the heat-absorbing end 31 bearing on the heat-producing element 41 and the heat-dissipating end 32 connected to the liquid cooling unit 2. Heat produced by the heat-producing element 41 is absorbed by the heat pipe 3 at the heat-absorbing end 31 and then transferred via the heat-dissipating end 32 to the liquid cooling unit 2, and is finally dissipated into ambient air. Since the heat pipe 3 is able to absorb and e...
second embodiment
[0018]In the second embodiment, the heat pipe 3 also has a heat-absorbing end 31 and a heat-dissipating end 32. The heat-absorbing end 31 is bearing on the heat-producing element 41. When the heat-producing element 41 produces heat, the heat-absorbing end 31 of the heat pipe 3 absorbs and transfers the produced heat to the remote heat-dissipating end 32. The heat-dissipating end 32 is inserted into the dissipating space 23 of the liquid cooling unit 2, which is located outside the system 4, so that the fluid in the dissipating space 23 can cool the heat-dissipating end 32 to achieve the purpose of dissipating heat.
[0019]In the present invention, by using the heat pipe 3 as a medium for conducting heat, the heat produced by the heat-producing element 41 can be exactly transferred to an outer side of the system 4 without accumulating therein. Moreover, with the heat pipe 3 being used as the medium of conducting heat, the problem of fluid leak is eliminated and damage to electronic com...
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