Semiconductor device

US20100102459A1Inactive Publication Date: 2010-04-29PANASONIC CORP
7 Cites 9 Cited by

Patent Information

Authority / Receiving Office
US Β· United States
Current Assignee / Owner
PANASONIC CORP
Publication Date
2010-04-29
Estimated Expiration
Not applicable Β· inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The semiconductor device includes: a semiconductor chip; a die pad for holding the semiconductor chip; a lead; and a sealing resin material for sealing the semiconductor chip, the die pad and an inner portion of the lead. The die pad has an upset portion protruding upward to form a flat face smaller in area than the semiconductor chip, and the portion of the die pad excluding the upset portion is covered with a buffer resin material smaller in elasticity than the sealing resin material.
Need to check novelty before this filing date? Find Prior Art

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority under 35 U.S.C. Β§119 on Patent Application No. 2008-278088 filed in Japan on Oct. 29, 2008 and Patent Application No. 2009-73699 filed in Japan on Mar. 25, 2009, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION

[0002] The present invention relates to a semiconductor device including at least one semiconductor chip sealed in a package.

[0003] At present, a standardized surface-mount type semiconductor package is configured as follows: a semiconductor chip is fixed to a die pad of a lead frame made of a cupper (Cu) alloy or an iron-nickel (Feβ€”Ni) alloy by die bonding, a bonding pad (electrode pad) of the semiconductor chip and the end of each lead of the lead frame are wire-bonded to each other with a metal wire made of gold (Au) and the like, and the resultant chip is resin-molded using a mold having a predetermined shape.

[0004] In recent years, with the progression o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More