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Optical thin-film vapor deposition apparatus and optical thin-film production method

a technology of optical thin films and vapor deposition apparatus, which is applied in vacuum evaporation coatings, plasma techniques, coatings, etc., can solve the problems of increasing the distance between the ion source and each of the substrates, difficult in conventional techniques, and inability to keep the film-quality of the optical thin-film to be resultingly obtained, so as to achieve homogenization of the thin-film structure, effective improvement of film-quality, and increase the energy to be provided to the vapor d

Inactive Publication Date: 2011-10-27
SHINCRON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present patent describes an optical thin-film vapor deposition apparatus and method for producing optical thin-films with a high quality and a high effect of ion assistance. The apparatus includes an ion source and a substrate holder positioned opposite each other, allowing for a more uniform film-formation efficiency and higher quality optical thin-films. The technical effects of the patent include improved film-formation efficiency and higher quality optical thin-films.

Problems solved by technology

However, in case of the technique disclosed in the Patent Document 2, the substrate holder is made planar, so that the ion assistance effect to be obtained by the ion source provided at a lateral side of the vacuum vessel is not likely to be kept constant relative to substrates, thereby causing a problem that a film-quality of an optical thin-film to be resultingly obtained is not likely to be kept homogeneous.
It has been thus difficult in the conventional techniques to obtain an optical thin-film having superior optical characteristics with a homogeneous film-quality, while obtaining a higher ion assistance effect.
In turn, in case that the maximum angle to be formed by the axis of the ion beam relative to the line perpendicular to the surface of each of the substrates is smaller than 8°, the distance between the ion source and each of the substrates is increased to disadvantageously decrease the ion assistance effect.
However, even when the ion source is provided on the side surface of the vacuum vessel at this time, if the maximum angle to be formed by the axis of the ion beam relative to the line perpendicular to the surface of each substrate is out of the above angle range, and particularly larger than 40°, the ion source is obliged to be constitutionally disposed near the substrates as vapor deposition targets, so that the ion source is exposed to a sputtered vapor deposition substance and is apt to be contaminated thereby.

Method used

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  • Optical thin-film vapor deposition apparatus and optical thin-film production method
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  • Optical thin-film vapor deposition apparatus and optical thin-film production method

Examples

Experimental program
Comparison scheme
Effect test

example 2

[0116]Next, the result of conducting film formation by using the optical thin-film vapor deposition apparatus 1 shown in FIG. 1 will be explained with reference to FIG. 3. FIG. 3 is a graph of another relationship between mounting angle (ion-beam incidence angle) θ and a sum of a transmission and a reflectance of an optical thin-film, and shows a sum of transmission T+reflectance R at a wavelength λ=550 nm. The measured mounting angles θ were within a range of 0 to 85°. The mounting angle θ was varied by adjusting the mounting position of the ion source 38, and the attachment 44 itself.

[0117]Whereas Example 1 was conducted by setting the energy density of the ion beam at 50 mW / cm2 as noted above, film formation was conducted in Example 2 by setting the energy density of ion beam as follows and the mounting angle θ at 0 to 85°. The mounting angle θ was varied by adjusting the mounting position of the ion source 38, and the attachment 44 itself. Further, whereas the film of Example 1 ...

example 3

COMPARATIVE EXAMPLE 1

[0136]Example 1 (mounting angle θ=40°), where the film formation was conducted by using the optical thin-film vapor deposition apparatus 1 shown in FIG. 1, will be explained by comparing it with Comparative Example 1 (mounting angle θ=0°), where film formation was conducted by using the conventional optical thin-film vapor deposition apparatus (see FIG. 7). It is noted that the mounting angle θ=0° corresponds to a situation where the ion source 38 is positionally coincident with a center of curvature of the substrate holder 12. In each of Example 1 and Comparative Example 1, the high refractive index substance and low refractive index substance as the vapor deposition substances were alternately film-formed. It is noted that, formed in each of Example 1 and Comparative Example 1, was a multi-layer film for a short wavelength pass filter (SWPF), comprising 36 layers adopting Ta2O5 as the high refractive index substance and SiO2 as the low refractive index substa...

examples 4 and 5

[0183]FIG. 6 is a graph showing a sum of a transmission T and a reflectance R of each of the optical thin-films of Examples 4 and 5, and the graph was obtained by irradiating light having a wavelength λ over a range of 400 to 1,000 nm to each fabricated multi-layer film and by plotting a sum value (transmission T+reflectance R) of the transmission T and reflectance R at the wavelength λ in relation thereto. In each of Examples 4 and 5, the high refractive index substance and low refractive index substance as the vapor deposition substances were alternately film-formed. It is noted that, formed in Examples 4 and 5, was a multi-layer film for a short wavelength pass filter (SWPF), comprising 36 layers adopting Ta2O5 as the high refractive index substance and SiO2 as the low refractive index substance. Further, measurement results concerning optical characteristics of the fabricated SWPF multi-layer films are shown in FIG. 6.

[0184]The film-forming condition of Examples 4 and 5 was as f...

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Abstract

A method of vapor depositing a vapor deposition substance onto substrates within a vacuum vessel includes holding the substrates with a dome shaped holder disposed within the vacuum vessel, rotating the dome shaped holder, vapor depositing a substance from a vapor deposition source disposed oppositely to the substrates, supplying ions from an ion source to the substrates, and supplying neutralizing electrons from a neutralizer to the substrates.

Description

TECHNICAL FIELD[0001]The present application describes an optical thin-film vapor deposition apparatus and an optical thin-film production method, and particularly an optical thin-film vapor deposition apparatus comprising an ion source for irradiating ions onto a substance body, and an optical thin-film production method.BACKGROUND ART[0002]Vapor deposition apparatuses, i.e., ion-assisted vapor deposition apparatuses, have been conventionally known, each configured to irradiate ions onto a vapor deposition layer deposited on a substrate by vaporizing a thin-film material toward a surface of the substrate within a vacuum vessel, thereby densifying the vapor deposition layer. In each of such vapor deposition apparatuses, an ion beam(s) (gas ions) of relatively low energy is / are irradiated onto a substance body (or substance bodies) by an ion source(s), and neutralizing electrons (electrons) are irradiated onto the substance body (or substance bodies) by a neutralizing device called a...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B05D3/06C23C14/22C23C14/24
CPCC23C14/083C23C14/10C23C14/22H01J2237/3132C23C14/225H01J2237/0041C23C14/221
Inventor NAGAE, EKISHUJIANG, YOUSONGSHIONO, ICHIROSHIMIZU, TADAYUKIHAYASHI, TATSUYAFURUKAWA, MAKOTOMURATA, TAKANORI
Owner SHINCRON KK