Radiative cooling of optoelectronic devices using hyperbolic metamaterials

Abstract

A method of radiative cooling of optoelectronic devices using a hyperbolic metamaterial TIM layer below the heat generating optoelectronics is disclosed. Optoelectronic devices are optimized for high radiative heat conductance due to broad hyperbolic frequency band in the Long-Wavelength Infrared (LWIR) range with an efficient electromagnetic black hole thermal interface between the metamaterial TIM layer and a metallic heat sink. A modified Stefan-Boltzmann law in the hyperbolic metamaterial layer enables domination of the radiative heat transfer in the TIM layer. The broadband divergence of the photonic density of states in hyperbolic metamaterials leads to an increase in radiative heat transfer, beyond the limit set by the Stefan-Boltzmann law. The resulting radiative thermal hyper-conductivity approach or even exceed heat conductivity via electrons and phonons in regular solids.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This Application claims rights under 35 USC §119(e) from U.S. Application Ser. No. 61 / 661,588 filed 19 Jun. 2012 the contents of which are incorporated herein by reference.TECHNICAL FIELD[0002]Embodiments are generally related to thermal management techniques. Embodiments also relate to a thermal interface management (TIM) metamaterial having very high heat conductance dominated by thermal radiation. Embodiments additionally relate to a system and method of dissipating heat generated by electronic and optical signal processing devices.BACKGROUND OF THE INVENTION[0003]Dissipation of heat generated by electronic and optical signal processing devices is a major problem which limits device performance in harsh military and civilian applications. The problem is severe when large amount of heat has to be dissipated over a small period of time. Significant enhancements in fundamental device materials, technologies, and system integration have le...

AI Technical Summary

Problems solved by technology

Dissipation of heat generated by electronic and optical signal processing devices is a major problem which limits device performance in harsh military and civilian applications.

The problem is severe when large amount of heat has to be dissipated over a small period of time.

Significant enhancements in fundamental device materials, technologies, and system integration have led to rapid increase in the total power consumption of CMOS, tele-communication, active sensing and imaging devices.

However, relatively little progress has occurred in thermal management techniques mainly in the high heat conductance materials and TIMs.

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