This invention relates to the fields of
electromagnetic shielding and micro / nano
photonics, and discloses a near-field shield based on layered
hyperbolic metamaterials and its fabrication method. The shield is constructed by stacking a substrate, a layered hyperbolic
metamaterial, and a capping layer sequentially from bottom to top. The layered hyperbolic
metamaterial is composed of alternating
metal and
dielectric layers, with each functional layer having a subwavelength thickness. The capping layer is located on the outermost side to provide
impedance matching and
physical protection. In this subwavelength
layered structure, utilizing its unique hyperbolic dispersion characteristics in the operating
wavelength band, external near-field evanescent
waves can be efficiently coupled into volume
modes within the structure, and absorbed and dissipated through the ohmic loss of the
metal layers, thereby blocking electromagnetic energy penetration towards the substrate. This invention features a compact structure and process compatibility, effectively solving the problem of near-field
signal crosstalk between adjacent components in high-density
optoelectronic integrated circuits, and has significant application value in the
electromagnetic compatibility design of on-
chip optical interconnects and nanophotonic devices.