Polishing method

Active Publication Date: 2014-01-16
EBARA CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a polishing method that reduces the time required for re-polishing of a substrate and eliminates the need for re-polishing. This is achieved by measuring the film thickness of a wet substrate and adjusting the polishing conditions based on the measured film-thickness result. This improves the throughput and reduces the time required for polishing the substrate. The film thickness sensor is calibrated using the measured film thickness to improve accuracy in in-situ film thickness measurement and eliminate the need for re-polishing.

Problems solved by technology

Such re-polishing (which is so-called rework) is effective at realizing an accurate film thickness, but on the other hand it takes a certain time from the first polishing step to the re-polishing step, lowering the productivity (throughput).
However, such an operation results in a lowered productivity (throughput).

Method used

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Embodiment Construction

[0054]Embodiments will be described with reference to the drawings.

[0055]FIG. 3 is a view showing a polishing apparatus capable of performing an embodiment of a polishing method. As shown in FIG. 3, the polishing apparatus has a housing 1 in a rectangular shape. An interior space of the housing 1 is divided by partitions 1a and 1b into a load-unload section 2, a polishing section 3, and a cleaning section 4. The polishing apparatus includes an operation controller 5 configured to control wafer processing operations.

[0056]The load-unload section 2 has front load sections 20 on which wafer cassettes are placed, respectively. A plurality of wafers (substrates) are stored in each wafer cassette. The load-unload section 2 has a moving mechanism 21 extending along an arrangement direction of the front load sections 20. Two transfer robots (loaders) 22 are provided on the moving mechanism 21, so that the transfer robots 22 can move along the arrangement direction of the front load sections...

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Abstract

A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type film thickness measuring device prior to cleaning and drying of the substrate; measuring a thickness of the film by the wet-type film thickness measuring device; comparing the thickness with a predetermined target value; and if the thickness has not reached the predetermined target value, performing re-polishing of the substrate in the polishing section prior to cleaning and drying of the substrate.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This document claims priority to Japanese Patent Application No. 2012-154975, filed Jul. 10, 2012, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a method of polishing a substrate, such as a wafer, and more particularly to a polishing method including the steps of measuring a film thickness of the substrate after polishing it and re-polishing the substrate if the film thickness has not reached a target value.[0004]2. Description of the Related Art[0005]Semiconductor devices are expected to become finer and finer in the future. In order to realize such a fine structure, a polishing apparatus, which is typified by a CMP apparatus, is required to have a more precise processing controllability and a high polishing performance. Specifically, a more accurate remaining film control (i.e., more accurate detection of a polishing end p...

Claims

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Application Information

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IPC IPC(8): H01L21/306
CPCH01L21/30625H01L22/12B24B37/013B24B37/042B24B49/12G01B7/105G01B11/0625G01B11/0683H01L21/31053H01L21/3212H01L21/76224H01L21/76819H01L21/7684H01L22/20B24B37/005B24B37/04B24B37/20B24B37/30H01L21/304H01L21/31055H01L21/67075H01L21/67092H01L21/67253
InventorIIZUMI, TAKESHIWATANABE, KATSUHIDEKOBAYASHI, YOICHI
OwnerEBARA CORP