Direct connect orthogonal connection systems

Abstract

A direct-attach orthogonal electrical connection system with improved high frequency performance is provided. A conductive member is provided between first and second components, each having signal and ground conductors. The conductive member is electrically coupled to ground conductors of both the first and second components and may also have openings through which signal conductors of the first and second components may connect. As such, signal conductors may be positioned relative to the conductive member such that a uniform impedance is maintained along a signal path throughout the interconnection, reducing noise and reflections. The first-type conductive elements may be formed with multiple beams of different lengths to create multiple points of contact distributed along an elongated dimension. For example, a third beam may be fused to a mating portion to allow a tolerance for deviations in alignment between two directly attached connectors.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS AND CLAIM OF PRIORITY[0001]This application claims the benefit of priority of U.S. Provisional Patent Application No. 61 / 712,141, filed on Oct. 10, 2012 and entitled “Direct Connect Orthogonal Connection Systems,” hereby incorporated by reference in its entirety.BACKGROUND[0002]This disclosure relates generally to electrical interconnection systems and more particularly to high speed electrical connectors.[0003]Electrical connectors are used in many electronic systems. It is generally easier and more cost effective to manufacture a system on several printed circuit boards (“PCBs”) than to manufacture a system as a single assembly. Printed circuit boards are sometimes referred to as daughter boards or daughter cards, and are held in a card cage. Electrical connections are then established between the daughter cards.[0004]A traditional arrangement for interconnecting daughter cards is to use a backplane. The backplane is a large PCB that contain...

AI Technical Summary

Benefits of technology

The patent is about improving signal integrity in a direct connect orthogonal connector. This can be done by using techniques such as volume manufacturing and grounding conductors. These techniques can help reduce noise and reflections, resulting in a more reliable and efficient connection system.

Problems solved by technology

However, using a direct connect orthogonal configuration also creates some challenges, including maintaining signal integrity when twisting internal signal conductors and ground conductors to interconnect two orthogonal daughter cards.

Also a lack of a rigid physical support structure, such as a midplane or a backplane, that can provide mechanical alignment for the daughter cards can create challenges.

One of the difficulties in making a high density, high speed connector is that electrical conductors in the connector can be so close that there can be electrical interference between adjacent signal conductors.

Maintaining signal integrity can be a particular challenge in a direct connect orthogonal configuration.

Such changes are difficult to avoid in a direct connect orthogonal connector in which the signal conductors need to be routed from a board to another orthogonal board.

These mechanical requirements may preclude the use of shielding, or may dictate the use of conductive material in places that alters the impedance of the conductive elements in the vicinity of the mating interface.

Images