Light emitting diode component

a technology of light emitting diodes and components, applied in the field of single-chip and multiple-chip light emitting diodes, can solve the problems of low light output intensities low light output intensity of early light emitting diodes, and general inability to compete with incandescent and fluorescent light sources. , to achieve the effect of reducing the cost improving the efficiency of light emitting packages, and improving the quality of light emi

a technology of light emitting diodes and components, applied in the field of single-chip and multiple-chip light emitting diodes, can solve the problems of low light output intensities low light output intensity of early light emitting diodes, and general inability to compete with incandescent and fluorescent light sources. , to achieve the effect of reducing the cost improving the efficiency of light emitting packages, and improving the quality of light emi

US20140328046A1Active Publication Date: 2014-11-06CONSUMER LIGHTING (U S) LLC
10 Cites 48 Cited by

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light emitting diode component
  • Light emitting diode component
  • Light emitting diode component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050]With reference to FIGS. 1-3, a light emitting package 8 includes a printed circuit board 10 on which one or more light emitting chips or die are disposed. The printed circuit board is preferably substantially thermally conductive. For example, a metal core printed circuit board can be employed. In the illustrated embodiment, three light emitting chips or dice 12, 14, 16 are disposed on the circuit board 10; however, the number of dice can be one die, two dice, or more than three dice. The die or dice can be group III-nitride blue or ultraviolet light emitting diodes, red group III-phosphide or group III-arsenide light emitting diodes, II-VI light emitting diodes, IV-VI light emitting diodes, silicon or silicon-germanium light emitting diodes, or the like. As used herein, the term “ultraviolet” is intended to encompass light emitting diode emission having a peak wavelength less than or about 425 nm. In some contemplated embodiments, the die or dice are edge emitting lasers or v...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Description

[0001]This application is a continuation of application Ser. No. 11 / 312,268 filed Dec. 20, 2005 which is a continuation-in-part of application Ser. No. 10 / 831,862 filed Apr. 26, 2004 and since issued as U.S. Pat. No. 7,224,000 which is a continuation-in-part of International Application number PCT / US2003 / 027363 with an international filing date of Aug. 29, 2003 first published Mar. 11, 2004 as International Publication no. WO 2004 / 021461 A2, which claims the benefit of U.S. Provisional Application Ser. No. 60 / 407,426 filed on Aug. 30, 2001 This application is also a continuation-in-part of application Ser. No. 10 / 909,564 filed Nov. 2, 2004 and since issued as U.S. Pat. No. 7,768,189.[0002]This application incorporates by reference the content of application Ser. No. 11 / 312,268, which has published as US 2006-0097245 A1. This application incorporates by reference the content of application Ser. No. 10 / 831,862, which has issued as U.S. Pat. No. 7,224,000 and has published as US 2005-0...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
06 Nov 2014
Publication
US20140328046A1
IPC
F21K99/00; F21V13/08
CPC
F21K9/56; F21V13/08; H01L33/46; H01L33/505; H01L33/507; H01L33/508; H01L33/58; H01L33/60
Inventors
AANEGOLA, SRINATH K.; RADKOV, EMIL V.