Switched power stage with integrated passive components

Abstract

A scalable switching regulator architecture may include an integrated inductor. The integrated inductor may include vias or pillars in a multi-layer substrate, with selected vias coupled at one end by a redistribution layer of the multi-layer substrate and, variously, coupled at another end by a metal layer of a silicon integrated circuit chip or by a further redistribution layer of the multi-layer substrate. The vias may be coupled to the silicon integrated circuit chip by micro-balls, with the vias and micro-balls arranged in arrays.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of the filing date of U.S. Provisional Patent Application No. 62 / 086,081, filed on Dec. 1, 2014, the disclosure of which is incorporated by reference herein.BACKGROUND OF THE INVENTION[0002]A power distribution network (PDN) in a system-on-chip (SoC) used in various mobile device typically includes on-chip metallization layers connecting to a package substrate via micro-bumps or copper pillars. The micro-bumps may be connected to balls of the package by vias and one or more redistribution layers (RDLs) within the package, with the balls of the package coupled to a printed circuit board (PCB). This generally results in a significant parasitic inductance which has become a significant limiting factor in the performance of the mobile devices as higher frequencies and higher currents generate local transient effects, which are also referred to as droops due to fast changes in the load currents.[0003]In order...

AI Technical Summary

Benefits of technology

The invention is about a structure that uses micro-bumps and RDL metallization to create a desired magnetic field path in a switching voltage regulator. This structure is designed to maximize and minimize the inductance on the switches of the regulator. The size and current capability of the micro-bumps are chosen to match the inductor core area, magnetic field path length, and the number of turns that can be constructed to achieve the desired inductance with a high L / R ratio. This structure can be used in a multiphase buck converter or other types of converters with coupling inductors. The technical effect of this invention is to improve the performance and efficiency of switching voltage regulators.

Problems solved by technology

This generally results in a significant parasitic inductance which has become a significant limiting factor in the performance of the mobile devices as higher frequencies and higher currents generate local transient effects, which are also referred to as droops due to fast changes in the load currents.

One of the biggest challenges, however, in implementing an eVR is to manufacture inductors with high inductance to resistance value (L / R: inductance [nH] per resistance [mohms]) with small form factor (current rating per square millimeter).

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