Composite thin copper foil and carrier
a thin copper foil and carrier technology, applied in the direction of flexible printed circuits, non-metallic protective coating applications, coatings, etc., can solve the problems of poor bonding strength of the carrier layer and thin copper foil by rolling, wrinkles and blisters,
Active Publication Date: 2018-08-02
CHANG CHUN PETROCHEMICAL CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Benefits of technology
The patent text describes a method for making a printed circuit board by using a special coating called benzotriazole (BTA) to prevent the circuit board from sticking to the roller press during the process. A release layer made of metal or organic compounds can also be added to improve adhesion and allow for easy removal of the carrier layer. The technical effect is to improve the manufacturing process for printed circuit boards.
Problems solved by technology
Therefore, the bonding strength of the carrier layer and thin copper foil by rolling becomes poor and non-uniform, and then wrinkles and blisters can happen on the interface between the carrier layer and the thin copper foil.
Method used
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example 1
[0065]An untreated electrodeposited copper foil of 18 μm in thickness was used for the carrier layer 10. At the beginning, the carrier layer 10 was directed into an acid washing / cleaning process. In the acid washing process, the inside of an acid washing vessel was filled with an electrolyte solution 82, which had 130 g / L copper sulfate and 50 g / L sulfuric acid, and the temperature of electrolyte solution was maintained at 27° C. The carrier layer was soaked into the electrolyte solution 82 for 30 seconds to remove the oil or fat and oxide on the surface and then the carrier layer was washed with water.
[0066]After the acid cleaning process, the carrier layer 10 was subjected to the chromium release layer formation on the drum side (surface roughness Rz3; the electrolysis conditions were that the solution 83 temperature was 27° C., the current density was 2 A / dm2 and the chromium release layer was formed with 40 μg / dm2 of chromium. On completion of the chromium release layer formatio...
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Abstract
A method and production of composite foils and thin copper foils peeled from said composite copper foils is disclosed for use in forming printed circuit boards (PCB). Either the composite foil or only the thin copper foil can be laminated to a polymer layer to form the printed circuit board, with the step of separating the thin copper foil from the composite copper foil is performed subsequent to said laminating step.
Description
FIELD OF THE DISCLOSURE[0001]The present disclosure relates to a composite foil structure including a structural carrier layer, which can be a thick carrier layer having a first side and an second side and one release layer is provided in contact with at least one of the first side and the second side. A thin electrodeposited copper foil having a first side and a second side, with one of the first or second sides in contact with the release layer is provided. One nodular layer and anti-tarnish layer may optionally be deposited on at least one of the first or second sides of the carrier layer, the side of the thick carrier layer opposite the release layer and optionally on the second side of the thin electrodeposited copper foil. The composite foil is provided with an organic layer on the anti-tarnish layer(s) if present, or on nodular layer(s) if present, or directly on one of the first or second sides of the carrier layer. Methods of producing the composite foil, separating a thin ...
Claims
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IPC IPC(8): H05K1/09H05K3/00H05K3/18H05K3/28C25D3/38C25D5/48C25D7/00
CPCH05K1/09H05K3/007H05K3/188H05K3/28H05K2201/05C25D5/48C25D7/00H05K2203/1545H05K2203/0143C25D3/38C25D1/04C25D1/20C25D5/14C25D7/0614C25D5/605C25D5/627H05K2201/0355C25D3/04B05D5/08C09D5/448C25D1/22
Inventor JUO, TSANG-JINCHENG, KUEI-SENLAI, YAO-SHENGCHOU, JUI-CHANG
Owner CHANG CHUN PETROCHEMICAL CO LTD