Filp chip package
a chip and chip technology, applied in the field of semiconductor chip packages, can solve the problems of difficult modification of the contact density of the ic chip, and achieve the effect of compact volume and high output pin coun
Active Publication Date: 2020-10-01
HIMAX TECH LTD
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
This design enhances the output pin count and contact density of flip chip packages, facilitating high-resolution electronic devices while maintaining a compact volume and simplifying the manufacturing process.
Problems solved by technology
However, restricted by the manufacturing limits and the manufacturing cost, the contact density of the IC chip is not easy to be modified.
Method used
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Embodiment Construction
[0027]FIG. 1 schematically illustrates a cross section of a flip chip package in accordance with an embodiment of the disclosure. Referring to FIG. 1, a flip chip package 100 may include a substrate 110, a chip body 120 bonding on the substrate 110 and a plurality of bumps 130. The chip body 120 may be bonded on the substrate 110 through the bumps 130 in a manner that an active surface 120S of the chip body 120 faces the substrate 110. The bumps 130 may be gold bump, solder bumps, copper bumps or similar metal bumps, and the chip body 120 may be connected by tin-gold eutectic bonding method, ACF (Anisotropic Conductive Film) bonding method, SMT (Surface-mount technology) reflow method to be electrically connected to the substrate 110 through the bumps 130. The substrate 110 may be a FPC (Flexible Printed Circuit) film, a BGA (Ball Grid Array) substrate, a COF (Chip On Film) tape or a COG (Chip On Glass) glass substrate and include a plurality of wires 112 formed thereon. The chip bo...
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A flip chip package includes a substrate, a chip body bonding on the substrate and bumps connected between the chip body and the substrate. The substrate includes input wires and output wires. The chip body includes a first package unit including a first seal ring and first pads and a second package unit including a second seal ring and second pads. The chip body extends continuously between the first seal ring and the second seal ring. Each of the input wires has one end overlapping the chip body and the other end positioned at a first bonding region of the substrate. Each of the output wires has one end overlapping the chip body and the other end positioned at a second bonding region of the substrate. The first bonding region and the second bonding region are located at opposite sides of the chip body.
Description
BACKGROUNDTechnical Field[0001]The disclosure is related to a semiconductor package, and particularly, to a flip chip package.Description of Related Art[0002]For the application in high resolution electronic devices, there is increasing demand for high output pin count of an integrated circuits (IC) chip. Among kinds of the package technology, the flip-chip bonding technology is commonly used for a high output pin count IC chip because the flip-chip bonding technology utilizes the solder / gold / Cu pillar bumps arranged on the active surface of the chip, which facilitates to achieve a large number of contacts and high contact density on a chip package. In addition, compared with the wire bonding technology, the solder / gold / Cu pillar bumps can provide shorter transmission paths between the chip and the carrier substrate so as to present a desirable performance.[0003]However, restricted by the manufacturing limits and the manufacturing cost, the contact density of the IC chip is not easy...
Claims
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IPC IPC(8): H01L23/00H01L23/498H01L23/538H01L23/10
CPCH01L24/09H01L23/3157H01L23/5386H01L23/49838H01L23/10H01L24/17H01L23/3114H01L23/3121H01L21/563H01L25/0655H01L24/10H01L23/3128H01L23/16H01L23/562H01L23/585H01L2924/3025H01L2224/16237H01L2224/0401H01L2224/13023H01L2224/17155H01L24/16H01L2224/04105H01L2224/12105H01L2224/24101H01L2224/24137H01L2224/96H01L2224/16227H01L24/24H01L24/96H01L23/50H01L22/34H01L2224/05599H01L2224/131H01L2224/13147H01L2224/13144H01L2924/00014H01L2924/014
Inventor CHENG, PAI-SHENGTU, WEN-CHIEH
Owner HIMAX TECH LTD