Transient-voltage-suppression diode structure and manufacturing method thereof
a diode and voltage-suppression technology, applied in the field of diodes, can solve the problems of difficult to obtain a zener diode structure having a low breakdown voltage, difficult to increase the concentration of n+ type implant layers, etc., to reduce the distance of deep implantation, reduce the difficulty of manufacturing process, and reduce the effect of parasitic resistan
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[0028]The present disclosure will now be described more specifically with reference to the following embodiments. It should be noted that the following descriptions of preferred embodiments of this disclosure are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
[0029]FIG. 2 is a cross sectional view illustrating a transient-voltage-suppression diode structure according to an embodiment of the present disclosure. In the embodiment, the transient-voltage-suppression diode structure 3 includes a substrate 30, at least one N− type epitaxial layer 35, a first metal layer 37, a first N+ type implant layer 42, a deep N+ type implant layer 43 and a plurality of polycrystalline plugs 44. The at least one N− type epitaxial layer 35 is disposed on the substrate 30. Preferably but not exclusively, in the embodiment, the substrate 30 includes a P+ type base layer 32 and an N type epitaxial layer ...
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