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Reinforcement of glass substrates in flexible devices

a flexible device and glass substrate technology, applied in the field of displays, can solve the problems of incompatibility of conventional oleds, fragile thin glass substrates, and easy breakage, and achieve the effects of high stiffness and ductility, not affecting the flexibility of the substrate, and cost-effectiveness

Inactive Publication Date: 2006-04-11
PICTIVA DISPLAY INT LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is about a way to reinforce and stabilize flexible displays, especially OLED devices on ultra thin substrates, for use in chip cards and other thin flexible applications. A stiff and ductile cover lid is mounted on the substrate to protect it from breakage, and the lid and substrate are sealed to encapsulate the OLED devices and protect them from environmental and mechanical damage. The reinforcement process is suitable for large area, cost-effective mass production. The thickness of the fabricated OLED display is less than 0.6 mm.

Problems solved by technology

As such, conventional OLEDs are incompatible since they are too thick and are typically more than 2 mm thick.
However, the thin glass substrates are fragile and susceptible to breakage due to mechanical stress, such as bending of the chip card.

Method used

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  • Reinforcement of glass substrates in flexible devices
  • Reinforcement of glass substrates in flexible devices
  • Reinforcement of glass substrates in flexible devices

Examples

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Embodiment Construction

[0015]The invention relates generally to flexible devices formed on thin substrates. In one embodiment of the invention, a flexible OLED device is formed on a thin glass substrate. In one embodiment of the invention, a stiff and ductile metal cover is mounted on the substrate to reinforce it and prevent it from breaking. The OLED device is particularly useful in thin flexible surfaces, for example, chip cards.

[0016]FIG. 2 shows a fabricated display 400, according to one embodiment of the invention, integrated into a flexible chip card 300. Typically, the chip card has outer dimensions of 86 mm by 54 mm with a thickness of 0.7 mm. For a seven-segment display, for example, the OLED display typically occupies an area of 22 mm by 10 mm. Since the display occupies a small fraction of the entire chip card area, the bending motion applied during a bending test can be restricted to the region not occupied by the display. Hence, the non-display area absorbs the mechanical strain introduced t...

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PUM

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Abstract

A reinforcement technique used in the fabrication of displays, such as organic light emissive diode (OLED) display, is disclosed. A stiff reinforcement lid is mounted on a thin substrate to encapsulate the OLED cells. The lid serves to reinforce the thin flexible substrate and protect it from breakage. It comprises preferably of metal or other materials that have higher stiffness and ductility than the thin substrate. The fabricated display is compatible for integration into chip cards and other flexible applications.

Description

FIELD OF THE INVENTION[0001]The present invention relates to displays, such as organic light emitting diode (OLED) displays. More particularly, the invention relates OLED displays, which are compatible for integration in chip cards or other thin flexible applications.BACKGROUND OF THE INVENTION[0002]FIG. 1 shows a conventional OLED device 100. The OLED device comprises one or more organic functional layers 110 between first and second electrodes 105 and 115 formed on a substrate 101. The electrodes can be patterned to form, for example, a plurality of OLED cells to create a pixelated OLED device. Bond pads 150, which are coupled to the first and second electrodes, are provided to enable electrical connections to the OLED cells. A cap 160 is formed over the substrate to encapsulate the device, protecting the OLED cells from the environment such as moisture and / or air.[0003]The substrate is preferably made from glass due to its good barrier properties against moisture or air. Glass su...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05B33/04H01L27/32H01L51/52
CPCG06K19/07703H01L51/5237H01L27/32H10K59/80H10K59/874H10K59/871H10K59/8721H10K50/841H10K50/846H10K50/8423H10K59/00
Inventor GUENTHER, EWALDSOO, ONG KIAN
Owner PICTIVA DISPLAY INT LTD
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