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Optical semiconductor device

a technology of optical semiconductors and optical couplings, applied in semiconductor lasers, instruments, optical elements, etc., can solve the problems of generating tracking errors resulting from reducing optical output, deviation from the image point of the lens, etc., and achieves the effects of reducing cost, high performance, and reducing optical coupling precision

Inactive Publication Date: 2006-07-11
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The design achieves high precision optical coupling required for single-mode fibers while using cost-effective resin lenses, maintaining high performance and reducing manufacturing costs by compensating for temperature-induced deviations, allowing the device to be fabricated based on a multi-mode fiber structure.

Problems solved by technology

If an optical semiconductor device connected to the single-mode optical fiber is fabricated based on a structure of the optical semiconductor device connected to the multi-mode optical fiber, however, deviation from the image point of the lens is generated due to variations in the refractive index of the lens due to increase in temperature during operation.
Thus, tracking errors resulting from reduction in optical output are generated.

Method used

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first embodiment

[0029]FIG. 1 is a top plan view showing a configuration of an optical semiconductor device according to a first embodiment of the present invention.

[0030]As shown in FIG. 1, this optical semiconductor device includes a semiconductor laser (a semiconductor chip used as light source) 3, one resin lens (a lens system) 6 for converging light output from the semiconductor laser 3, conductive stem assembly 1 and 2 for mounting the semiconductor laser 3 thereon, and lens support assembly 4 and 5 (formed of a sleeve 4 and a lens holder) for supporting the resin lens 6 and maintaining a predetermined distance from the semiconductor laser 3.

[0031]The resin lens 6 is formed by inserting a resin material into a die having a cavity of its shape for molding. As a material for the resin lens 6, liquid crystal polymer can be employed.

[0032]The stem assembly (or system) (1, 2) is constituted from a base 1 and a mounting member 2 for the semiconductor laser 3. Each of the base (flange) 1 and the moun...

second embodiment

[0046]FIG. 3 is a top plan view showing a configuration of an optical semiconductor device according to a second embodiment of the present invention.

[0047]The difference from the optical semiconductor device in the first embodiment is that a sleeve (lens support) 11a, a lens holder (lens support) 11b, and a lens system 11c constituted from one or more resin lenses are integrally formed. This single-piece structure can be formed by injecting a resin material into a die having a cavity of its corresponding shape for molding. Here, the components indicated by the same reference symbols as those in FIG. 1 represent the same components as in FIG. 1.

[0048]According to the optical semiconductor device in the second embodiment of the present invention, as in the optical semiconductor device in the first embodiment, high precision of the optical coupling required for the optical semiconductor device connected to the single-mode optical fiber can be obtained based on the structure of the opti...

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Abstract

An optical semiconductor device having high precision of optical coupling and fabricated at low cost. The device comprises a semiconductor chip used as light source 3, lens system 6 constituted from one or more resin lenses for converging light output from the semiconductor chip used as light source 3, a conductive base 2 for mounting the semiconductor chip 3 thereon, and lens support assembly 4 and 5 for maintaining a predetermined distance from the semiconductor chip 3 and supporting the resin lens 6. Deviation from the image point of the lens system 6 caused by change of the refractive index of the lens system 6 due to change in temperature is compensated for by change in the distance between the semiconductor chip 3 and the lens system 6, caused by thermal expansion of the electrically conductive base 2 and the lens support assembly 4 and 5.

Description

FIELD OF THE INVENTION[0001]The present invention relates to an optical semiconductor device. More specifically, the invention relates to an optical semiconductor device on which a plurality of optical components are mounted and optical coupling between the optical components is achieved.BACKGROUND OF THE INVENTION[0002]Conventionally, on optical semiconductor devices used for communications, a semiconductor laser as light source and a lens system are mounted, and an optical fiber is introduced from outside, for connection. Then, laser light modulated by a signal is rendered parallel by a collimator lens system or converged by a lens (system) for convergence, for outputting into the optical fiber.[0003]Generally, the former uses two collimator lenses and is used for applications in which high precision in terms of the optical coupling is required, and the manufacturing cost of the former tends to be higher. For example, structures as described in Patent Documents 1 and 2 are known. ...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L29/227G02B6/42H01S5/00H01S5/02H01S5/022
CPCG02B6/4201G02B6/4204H01S5/02288H01S5/02284H01S5/02252H01S5/02326H01S5/02251H01S5/02253
Inventor YAMADA, KOJI
Owner RENESAS ELECTRONICS CORP