Lighting device

Abstract

A lighting device with a stable high light intensity can effectively dissipate heat generated by an LED so that the light emission efficiency does not deteriorate while the inside temperature distribution can be maintained in an even state. The lighting device can also be configured to prevent snow from adhering onto an outer lens by allowing an outer surface temperature of the lighting device to rise during actuation of the device. The lighting device can also be configured to improve light utilization efficiency. The lighting device can include a semiconductor light emitting device as a light source and can include structure(s) that guides the emission light to a projection lens. The semiconductor light emitting device can be configured to emit light in a reverse or opposed direction with respect to an illumination direction for the lighting device. A projection lens can be disposed in front of the semiconductor light emitting device. An elliptic reflector can be configured to reflect light from the semiconductor light emitting device and to direct the light to the projection lens. A lens holder can be made of metal and the semiconductor light emitting device and the projection lens can be disposed on the lens holder.

Description

[0001]This application claims the priority benefit under 35 U.S.C. §119 of Japanese Patent Application No. 2008-159308 filed on Jun. 18, 2008, which is hereby incorporated in its entirety by reference.TECHNICAL FIELD[0002]The presently disclosed subject matter relates to a lighting device including a semiconductor light emitting device (such as an LED) as a light source, and in particular, to a lighting device for use in a vehicle, that takes certain measures against heat generated by such a semiconductor light emitting device.BACKGROUND ART[0003]Conventional vehicle lights have employed a high intensity discharge lamp (HID lamp with approximately 3200 lm) and a halogen bulb (with 1000 to 1500 lm) as a light source. In order to reduce the power consumption and miniaturize the entire body size of the light, a projector type vehicle light that employs a semiconductor light emitting device as a light source is proposed in, for example, Japanese Patent Application Laid-Open No. 2003-317...

AI Technical Summary

Benefits of technology

The present invention provides a lighting device for vehicles that can effectively dissipate heat generated by a semiconductor light emitting device and prevent snow adherence on the outer lens. The device includes a lens holder, semiconductor light emitting device, projection lens, and elliptic reflector. The elliptic reflector can reflect light that cannot be reflected by the semiconductor light emitting device out of the lighting device, improving light utilization efficiency. The lighting device can prevent fogging of the inner surface of the outer lens and extend its service lifetime. The device can also include a parabolic reflector to improve lighting efficiency. The technical effects of the invention include stable high light intensity, even heat dissipation, and prevention of snow adherence and fogging.

Problems solved by technology

When a plurality of LED lamp units are combined within a limited space for installing such a headlight, a projection lens having a corresponding size cannot be installed within such a limited space due to the size, posing a problem in which the light utilization efficiency deteriorates to lower the light intensity.

In this case, it would be difficult and sometimes impossible to obtain sufficient light intensity.

In this case, however, heat generation can be significant, and in some cases the semiconductor light emitting device can emit only a smaller amount of light than that in a normal condition or cannot be lit depending on the performance of the device due to the heat generation.

In addition, the high current high heat environment may shorten the service life of the semiconductor light emitting device.

Due to the heat from the engine room, the heat generated by the semiconductor light emitting device cannot be effectively and sufficiently dissipated and accordingly, the semiconductor light emitting device itself cannot be sufficiently cooled.

Even when partly cooled, the inside of the vehicle light may have an uneven temperature distribution.

This may cause a problem in which the inside of an outer lens can be fogged due to moisture build up or dew.

When the semiconductor light emitting device is an LED, the light emitted from the LED may contain a very small amount of an infrared ray component, meaning that the irradiated surface of the projection lens cannot be heated.

As the surface temperature cannot rise, when snow adheres to the surface of the outer lens, it may remain as it is and be difficult to remove.

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