Polyphenylene sulfide resin composition with improved thermal conductivity and surface appearance and articles thereof

Abstract

A polyphenylene sulfide resin composition comprises (A) about 30 to about 50% by weight of a polyphenylene sulfide resin; (B) about 1 to about 5% by weight of an amorphous polyamide resin; and (C) about 45 to about 69% by weight thermally conductive insulating fillers.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims priority under 35 USC Section 119 to and the benefit of Korea Patent Application No. 10-2011-0146941 filed Dec. 30, 2011, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.FIELD OF THE INVENTION[0002]This invention relates to a polyphenylene sulfide resin composition and articles made using the same.BACKGROUND OF THE INVENTION[0003]Typically, chassis and heat sinks of electronic devices have heat generating parts that are produced from metals. Metals are used for such parts because of their thermally conductive nature. Metals dissipate received heat to the surrounding area very rapidly as compared to other materials. Therefore, metals can maintain the electronic parts, which are sensitive to heat, under high temperature conditions. In addition, metals have high mechanical strength and can be readily processed using sheet metal, die and cutting pr...

AI Technical Summary

Benefits of technology

The present invention is a resin that has good heat conductivity, surface appearance, and physical properties such as electrical insulation. It can be used to make molded articles with these improved properties.

Problems solved by technology

Thus, metals are suitable materials for use as heat sinks, the shape of which can be complex.

However, it can be difficult to make heat sinks made of metal light weight because of the high density of metal.

Moreover, processing costs can be high with metals.

Moreover, as devices become thinner or lighter weight, the problem of dissipating generated heat is pronounced.

At times, serious problems can arise in electronic devices due to locally generated heat, which can ultimately cause malfunction or burning of the devices.

However, thermally conductive resins developed so far have low thermal conductivity, and accordingly there remains a need to solve the afore-mentioned problems using resins.

When thermally conductive insulating fillers are used in a large quantity in order to increase the thermal conductivity of the resin composition, the viscosity increases which in turn impairs the fluidity.

As a result, articles cannot be produced by the injection molding process.

In addition, the strength of the final product is not satisfactory.

However, resins with lower viscosity have low molecular weight which increases the reactivity between the molecular chains.

This in turn can lead to hardening during the extrusion or injection molding process.

However, although these fillers have a high thermal conductivity by themselves, they cannot be used in technological fields such as luminaries or electronic devices where electrical insulation property is required, because these fillers also have electrical conductivity.

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