Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Support and positioning structure, semiconductor equipment system and method for positioning

a positioning structure and positioning technology, applied in the field of semiconductor equipment systems, can solve the problems of increased risk of mistakes when transferring patterns, inability to include, and inability to operate in vacuum or near vacuum environments

Active Publication Date: 2015-02-10
ASML NETHERLANDS BV
View PDF45 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The solution effectively shields electromagnetic fields, ensuring precise positioning and movement within the vacuum environment, reducing the risk of errors and complexity, and enabling energy-efficient operation by minimizing the need for recalibration and heat dissipation.

Problems solved by technology

It is a disadvantage of the known system that the vacuum environment is localized and does not include the positioning and support structure.
The positioning of actual target surface outside the vacuum environment strongly increases the risk of mistakes when transferring a pattern to the target surface.
It is a disadvantage of this known system that radiation cooling does not function adequate in vacuum or near-vacuum environments.
Moreover, the use of a Peltier element in addition to radiation cooling complicates the equipment system.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Support and positioning structure, semiconductor equipment system and method for positioning
  • Support and positioning structure, semiconductor equipment system and method for positioning
  • Support and positioning structure, semiconductor equipment system and method for positioning

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038]In the figures, identical reference numbers relate to identical or at least comparable technical features. The Figures are not drawn to scale and intended for illustrative purposes only. The Figures show examples, which are not intended to limit the claims anyhow.

[0039]FIG. 1 shows a schematic cross-sectional view of the semiconductor equipment system 1 according to the invention. The equipment system 1 shown in the present figure is a system with a column 110, and more particularly a lithographic system or an inspection system. Specifically, it is a system in which charged particles beamlets are transmitted to the surface of a target 24. This target 24 is for instance a semiconductor wafer or a mask, though other targets such as an assembly carrier are not excluded.

[0040]In operation, the column 110 transmits beamlets to the target 24. In the case of a lithographic system, the beamlets are transmitted so as to transfer a pattern to at least a major portion of the surface of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a charged particle system provided with a support and positioning structure for supporting and positioning a target on a table, the support and positioning structure comprising a first member and a second member and at least one motor so as to move the first member relative to the second member, wherein a shield is present to shield at least one charged particle beam from electromagnetic fields generated by said at least one motor, the support and positioning structure further comprising a spring mechanically coupling the first member and the second member for at least partially bearing the weight of the first member, table and target.

Description

[0001]This is a non-provisional application claiming the benefit of U.S. Provisional Application No. 61 / 287,657 filed Dec. 17, 2009, and U.S. Provisional Application No. 61 / 287,661 filed Dec. 17, 2009.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to a semiconductor equipment system provided with a support and positioning structure that comprises a first member and a second member and at least one motor.[0004]The invention further relates to such support and positioning structure and to the use thereof.[0005]2. Description of the Related Art[0006]Support and positioning structures are widely used in semiconductor equipment systems, such as lithographic systems and inspection systems. In the case of a lithographic system, the first member is for instance a wafer stage onto which a semiconductor wafer may be attached. A typical example of a measurement system is an electron microscope. In order to achieve high resolutions as under development for...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(United States)
IPC IPC(8): H01J37/20
CPCH01J37/20B82Y10/00B82Y40/00H01J37/09H01J37/3177H01J2237/0264H01J2237/202G03F7/70808H01J37/3007H01J37/3056
Inventor PEIJSTER, JERRYMEHENDALE, ADITYAHILDERINK, ANDRE JOHANNES MARIA
Owner ASML NETHERLANDS BV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products