36results about How to "Reduce uneven force" patented technology

The invention belongs to the technical field of steel making and discloses a leveling method for cross break defects on the surface of a hot-rolled and acid-pickled plate. The leveling method comprises the steps that constant-rolling-force control is adopted by a hot-roll leveling unit, and a leveling and straightening mode is selected; a strategy of segmented pressure control over a deep bending roller is adopted, and the pressure of the deep bending roller is adjusted according to the cross sectional area of strip steel; and the elongation of the strip steel is controlled to be 3%-3.5%. By the adoption of the leveling method for the cross break defects on the surface of the hot-rolled and acid-pickled plate, the cross break defects are effectively eliminated; meanwhile, leveling operation is simplified, the probability of secondary leveling is lowered, and thus the product quality is improved.

The invention relates to a silicon wafer pressure setting and applying clamp for a plasma etcher, which comprises a clamp body, upright post screws, reset springs, pressing plates, tightening nuts and a numerical control torque wrench. The lower ends of the two upright post screws are fixed on the clamp body. The upper segments of the two upright post screws are provided with screw threads. The reset springs are sleeved on the upper segments of the upright post screws. The pressing plates are sleeved on the two upright post screws and are tightened by the tightening nuts. The tightening nuts are tightened by the numerical control torque wrench in a torque fixing mode. The whole stack of silicon wafers are arranged between the clamp body and the pressing plate and the pressing plate is tightened by the numerical control torque wrench through the two tightening nuts in a torque fixing mode, so that the pressure is set and applied to the whole stack of silicon wafers through the pressing plate. Therefore, the pressure of the whole stack of silicon wafers can be accurately controlled, nonuniform stress around the silicon wafers can be reduced, the products have consistent performance, and the etching effect is good.

The invention relates to an anaerobic adhesive used for sealing plastic members, and a preparation method thereof. The anaerobic adhesive comprises polyurethane methacrylate, a methacrylate monomer, a plasticizer, a promoter, a promoter aid, a strengthening agent, an initiator, a polymerization inhibitor and a chelating agent. The anaerobic adhesive used for sealing plastic members has the advantages of very good sealing effect, fast positioning time, no stress damages to the plastic members, and good stability, and can be preserved at normal temperature for at least two years.

The invention relates to the field of spiral gear machining and manufacturing equipment, in particular to involute spiral cylindrical outer gear grinding equipment. The involute spiral cylindrical outer gear grinding equipment comprises a cylindrical grinding support, a lathe bed, a supporting column and a driving system, wherein grinding heads are arranged on the inner wall of the grinding support, the grinding heads spirally surround the inner wall of the grinding support, and the winding distance of the grinding heads is consistent with that of a machined gear; the plurality of grinding heads which are close to one another and are used for grinding the adjacent tooth grooves of the to-be-machined gear form one grinding set, and the plurality of grinding sets are rotationally and symmetrically arranged relative to the central axis of the grinding support; and one end of the supporting column is installed on the driving system, the other end of the supporting column can be inserted into a machined gear shaft hole and drive the gear to rotate, the central axis of the supporting column coincides with the central axis of the grinding support, and the driving system can drive the supporting column to move along the central axis direction of the supporting column. The equipment has the advantages of being uniform in stress in the grinding process and high in grinding precision.

The invention provides a long-life LED light-emitting module and a processing method thereof. The LED light-emitting module comprises a transparent base, multiple LED dies and fluorescent powder rubber layers. The LED dies are bound on the front of the transparent base and arranged and bound according to at least one annular ring. The first fluorescent powder rubber layer covers the back of the transparent base. The second fluorescent powder rubber layer coats the front of the transparent base and is divided into at least one circular fluorescent powder rubber ring, the fluorescent powder rubber rings are in one-to-one correspondence to the annular rings, and each fluorescent powder rubber ring covers all the LED dies of the corresponding annular ring. The problem of LED lamp failure caused by the fact that gold wires of the LED light source module are disconnected under the impact of cyclic stress due to thermal expansion and contraction of the rubber layers is solved.

The invention relates to the field of gear production and processing, in particular to a spiral cylinder inner gear groove grinding device. The spiral cylinder inner gear groove grinding device comprises a cylindrical grinding bracket, a lathe bed, a gear fixture and a driving system, wherein grinding heads are arranged on the bracket, the grinding heads are spirally wound on the cylindrical surface of the bracket, and the winding distance of the grinding heads is consistent with that of to-be-processed gears; 3 to 6 grinding heads which are close to each other and are used for grinding adjacent gear grooves of the to-be-processed gears form a grinding group, and a plurality of grinding groups are rotatably and symmetrically arranged relative to the central axis of the grinding bracket; the gear fixture is arranged on the driving system, and a gear workpiece can be clamped and driven to rotate by the gear fixture; and the fixture can be driven to move to the grinding bracket by the driving system. The device has the advantages of uniform stress in a grinding process and high grinding precision.

The present invention provides a long-life LED lamp light-emitting unit and a long-life LED lamp. The long-life LED lamp light-emitting unit comprises a pedestal and LED bare crystals, wherein the pedestal comprises a plurality of transparent bearing substrates which are arranged at intervals and in parallel, multiple LED bare crystals are bonded between every two bearing substrates which are adjacent, the multiple LED bare crystals can be connected through a lead, the pedestal is coated with fluorescent glue layers so that lights emitted by the LED bare crystals go out of the pedestal after passing through the fluorescent glue layers. The fluorescent glue layers can be separated from connection points of gold threads, thus the tension force to the gold threads caused by thermal expansion and cold contraction of the fluorescent glue layer is avoided, and the phenomenon that the connection point is broken due to the tension force and an arc is generated to burn the crystal is avoided. According to the above structure of the long-life LED lamp light-emitting unit, non-uniform stress of the gold thread can be reduced; through multiple layers of light emitting bodies and the multiple layers of light emitting units, in the case of the same light-emitting efficiency, heat dissipation area is increased, thereby prolonging the service life of an LED lamp.

The invention relates to a polygonal brake device comprising an iron core assembly. The iron core assembly is provided with a guide pin (5) connected with an armature (9); a brake disk (10) is clamped and fixed between the armature (9) and a traction machine; both sides of the brake disk (10) are provided with friction plates (11), and the brake disk (10) is connected with a rotating shaft of thetraction machine through a spline. The polygonal brake device is characterized in that the iron core assembly comprises a polygonal iron core, a slot positioned on the polygonal iron core is internally provided with an annular coil (2); the armature (9) which corresponds to the iron core assembly is of a polygon; the connecting structures of the iron core (1) and the armature (9) are all arrangedon corners of the polygon. The invention can enhance the brake effect of the brake device and reduce the processing process of the brake device, thereby saving the production cost.

The invention discloses a stabilizing treatment device for a foundation pit slope. The stabilizing treatment device comprises a supporting base, wherein a rotating platform is rotatably arranged at the top end of the supporting base, a first vertical frame is arranged on one side of the upper portion of the rotating platform, a connecting rod is arranged on one side of the first vertical frame, a nested clamping rod is fixed to one end of the connecting rod, a crushing roller is rotationally arranged in the nested clamping rod, one end of the crushing roller is connected with a transmission assembly, and a lifting device used for lifting the connecting rod is arranged in the first vertical frame. The stabilizing device is suitable for stabilizing foundation pit side slopes of different depths, protruding soil piles on the surfaces of the side slopes can be leveled rapidly through the crushing roller, then the side slope soil layer can be compacted by controlling fixing blocks to hammer the side slopes through a reciprocating transmission device, leveling and pressing of the foundation pit side slopes are achieved, the stabilizing effect is good, and side slope mud blocks or stones can be prevented from falling to injure foundation pit constructors.

The invention belongs to the technical field of pipelines, and particularly relates to a preparation method of a polytetrafluoroethylene composite steel pipe, the polytetrafluoroethylene composite steel pipe takes expanded polytetrafluoroethylene as a lining film and methyl silicone resin as an adhesion layer, and the preparation method is provided. The problem that an existing polytetrafluoroethylene composite pipe is poor in mechanical performance is solved, the micropore characteristic of expanded polytetrafluoroethylene is utilized, the anti-corrosion protection requirement of polytetrafluoroethylene is met, air pressure shock absorption of bubble permeation can be formed, the problem of uneven stress caused by bubbles is solved, and the service life of polytetrafluoroethylene in liquid transmission is prolonged.

The invention discloses a nutrition bowl facilitating transplanting and field planting. The nutrition bowl facilitating transplanting and field planting comprises one or more longitudinal pull strips and one or more circumferential pull strips which are arranged on the side wall of a bowl body, wherein the upper ends of the longitudinal pull strips are positioned at the upper edge of the nutrition bowl, and the lower ends of the longitudinal pull strips are positioned at the circumferential braces; and the circumferential pull strips are parallel to the bottom plane of the nutrition bowl and are positioned at the positions, close to the bottom of the nutrition bowl, on the side wall of the bowl body. By arranging the longitudinal pull strips and the circumferential pull strips, when transplanting operation is carried out, a matrix in the nutrition bowl can be completely and nondestructively taken out without pulling seedlings by hands or flapping and vibrating the matrix due to the fact that the matrix adheres to the inner wall of the nutrition bowl, and it is guaranteed that the matrix does not deform and the roots of the seedlings are not damaged; and in the ridging and compacting process, due to the fact that the side wall of the nutrition bowl serves as a protection layer for the matrix, uneven external force generated on the matrix and the roots of the seedlings due to uneven circumferential pressure generated by ridging on the matrix can be reduced, and therefore, the effects of preventing the matrix from becoming loose and protecting the roots of the seedlings are achieved.

A manufacturing method of a chip package structure is provided. A circuit substrate and a chip are provided. The circuit substrate is formed with a two-stage thermosetting adhesive layer. An active surface of the chip is formed with a conductive pillar and a support pillar. The circuit substrate is passed through the two-stage thermosetting adhesive layer to abut the active surface of the chip. The two-stage thermosetting adhesive layer is dropped between the conductive pillar and the support pillar. A bonding process is performed, and the chip is electrically connected to the circuit substrate through the conductive pillar and supported by the support pillar to be positioned on the circuit substrate. The two-stage thermosetting adhesive layer is fully cured. An encapsulant is formed on the circuit substrate to encapsulate the chip, the conductive pillar, the support pillar and the two-stage thermosetting adhesive layer. A chip package structure is also provided.