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Rapid thermal processing system for integrated circuits

A rapid heat treatment, processing technology, applied in the field of systems for heating semiconductor substrates, which can solve the problems of increasing wafer size, limitations, etc.

Inactive Publication Date: 2007-09-19
MATTSON TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Increasing the size of wafers and focusing on increasingly larger windows for chambers to accommodate larger wafers has limited the potential for increasing the throughput of RTP systems employing lamp heating by processing multiple wafers in one chamber

Method used

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  • Rapid thermal processing system for integrated circuits
  • Rapid thermal processing system for integrated circuits
  • Rapid thermal processing system for integrated circuits

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Experimental program
Comparison scheme
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Embodiment Construction

[0038]FIG. 1 is a longitudinal sectional view of an apparatus 10 for rapid thermal processing (RTP) of semiconductor wafers 7 according to the prior art. Apparatus 10 has a housing 12 forming an intermediate chamber 11 in which wafers are placed for processing. An entry slot 26 at the first end of the vacuum chamber 11 allows placing the wafer 7 into the chamber 11 and resting on support pins 25 on the rotor 23 . The rotor 23 is supported for rotation on a pin 24 fixed to a boss 21a extending from the quartz window 21 and passing through a hole in the quartz liner 27 .

[0039] The quartz window 21 forms the lower boundary of the vacuum chamber 11 and is sealed from the remaining chamber parts by a seal 28 . The upper boundary of the chamber 11 is formed by a quartz window 20 . The quartz windows 20 , 21 are light transmissive and allow radiant heat energy to pass through into the cavity 11 . During wafer processing, process gases such as nitrogen oxide (NO), ammonia (NH 3...

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PUM

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Abstract

In a rapid thermal processing system an array of heat lamps generate radiant heat for heating the surfaces of a semiconductor substrate, such as a semiconductor wafer, to a selected temperature or set of temperatures while held within an enclosed chamber. The heat lamps are surrounded individually or in groups by one or more optically transparent enclosures that isolate the heat lamps from the chamber environment and the wafer or wafers therein. The optically transparent enclosures may include associated reflectors and / or lenses to direct a higher proportion of emitted radiant heat energy from the lamps toward the semiconductor wafer(s). Thin planar quartz liners may also be interposed between the lamsp and the substrate. By controlling radiant energy distribution within the chamber, and eliminating thick planar quartz windows commonly used to isolate the lamps in prior art RTP systems, higher processing rates and improved reliability are obtained.

Description

technical field [0001] This invention relates to the manufacture of integrated circuits. More specifically, the present invention relates to a system for heating a semiconductor substrate in a controlled pressure and temperature environment. Background technique [0002] Fabrication of integrated circuits such as metal oxide semiconductors (MOS) requires rapid thermal processing of semiconductor wafers under controlled pressure conditions such as vacuum conditions. For example, in the manufacture of MOS transistors, a gate oxide layer is typically formed by thermal oxidation of a silicon substrate in an atmosphere of substantially pure oxygen. However, in some applications such as MOS ULSI circuits, the gate oxide exhibits unfavorable characteristics, such as relatively high defect density and charge trapping and relatively low reliability and resistance problems due to thermal load effects. [0003] It is well known that the gate dielectric properties of MOS transistors c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/31H01L21/26
CPCH01L21/67115H05B3/0047H01L21/324
Inventor S·-P·泰Y·Z·胡M·豪夫
Owner MATTSON TECHNOLOGY