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Lithographic apparatus and device manufacturing method

A technology of photolithography and projection device, which is applied in photolithography process exposure devices, semiconductor/solid-state device manufacturing, irradiation devices, etc.

Inactive Publication Date: 2007-11-28
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These losses lead to an overall loss of beam intensity resulting in increased exposure times, reduced throughput, and localized loss of intensity resulting in loss of uniformity of the image projected on the substrate

Method used

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  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method

Examples

Experimental program
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Embodiment 1

[0039] Figure 1 schematically depicts a lithographic projection apparatus according to a particular embodiment of the invention. The unit includes:

[0040] a radiation system Ex, IL for providing a projection beam PB of radiation (e.g. EUV radiation), which in this particular case also includes a radiation source LA;

[0041] A first target table (mask table) MT provided with a mask holder for holding a mask MA (e.g. a reticle) and connected to a first positioning device PM for precise positioning of the mask relative to the object PL ;

[0042] The second target stage (substrate stage) WT is provided with a substrate holder for holding a substrate W (e.g., a resist-coated silicon wafer), and is connected with a first stage for precisely positioning the substrate relative to the object PL. Two positioning device PW connection;

[0043] A projection system ("lens") PL (eg mirror set) is used to image the radiation portion of mask MA onto a target area C of substrate W (eg c...

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PUM

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Abstract

A controlled aperture provides an opening through a barrier separating two parts of the apparatus to enable a pulse of radiation to be radiated from one part of the apparatus to the a second part. The controlled aperture closes the opening between the pulses of radiation to minimize the gas flow between the first and second parts.

Description

technical field [0001] The invention relates to a lithography projection device, comprising: [0002] - a radiation system for delivering a projected beam of pulsed radiation; [0003] a support structure for supporting a patterning device for patterning the projection beam in accordance with a desired pattern; [0004] a substrate stage for holding a substrate; and [0005] A projection system for projecting a patterned beam onto a target area of ​​the substrate. Background technique [0006] The term "patterning device" as used herein should be broadly construed as referring to a device capable of imparting a pattern in its cross-section to an incident beam of radiation, wherein said pattern is consistent with the pattern to be formed on a target area of ​​a substrate; the term "Light valve" is also used herein. Typically, the pattern corresponds to a specific functional layer of a device formed in the target area, such as an integrated circuit or other device (see bel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/00G03F7/20H01L21/027G21K1/04G21K5/00G21K5/02H05G2/00
CPCB82Y10/00G03F7/70916H05G2/00G21K1/04G03F7/70033G03F7/7055G03F7/70041G03F7/70166G21K1/043H01L21/027
Inventor L·P·巴克尔J·荣克尔斯A·J·J·范迪塞尔东克M·M·T·M·迪里希斯
Owner ASML NETHERLANDS BV