Method for restoring integrated circuit chip and printed steel plate private for the same

An integrated circuit and chip technology, which is applied in the field of repairing integrated circuit chips, can solve the problems of inability to plant balls and high difficulty in repairing, and achieve the effect of speed and convenience, good effect and fast speed.

Inactive Publication Date: 2008-11-05
YINGHUADA (SHANGHAI) ELECTRONIC CO LTD
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If you use the general ball planting method, the solder balls will melt together when heated, and it is impossible to plant balls at all.
If solder paste is printed on the PCB like SMT, since there are other components on the PCB during repair, the repair is very difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for restoring integrated circuit chip and printed steel plate private for the same
  • Method for restoring integrated circuit chip and printed steel plate private for the same
  • Method for restoring integrated circuit chip and printed steel plate private for the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0017] A method for repairing an integrated circuit chip of the present invention comprises the following steps: the first step is to clean the PAD of the chip to be ball-planted with a soldering iron; the second step is to clean the chip and equipment to be ball-planted with alcohol; In the third step, the lower die of the printed steel plate is placed flat on the base, and then the chip to be planted is placed on the lower die, and then the vacuum suction valve of the printed steel plate is opened (the vacuum suction valve refers to Figure 5 In the vacuum reversing valve 5); the fourth step is to fully match the upper mold and the lower mold of the printed steel plate, the chip is sandwiched between the upper and lower molds, and then brush the solder paste back and forth twice in the groove 8 of the upper mold (upper The groove 8 of mold i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a method for repairing the integrated circuit chip, which comprises: first, using brand iron to clear the welding point of planted chip, and using alcohol to clean the chip and device; then arranging the low mould of printing steel plate on the base and arranging the planted chip on the low mould, turning on the vacuum valve of printing steel plate; then matching the up and low moulds of printing steel plate to be brushed in the groove of up mould for two time; taking out the up mould and turning down the vacuum valve; at last, taking out the chip, using static hot wind gun to fuse the tin pastern. The invention also discloses a relative printing steel plate formed by up mould, low mould and base; the low mould is arranged on the base horizontally; the chip is arranged between the up and low moulds; the base is mounted with a vacuum breaker, a vacuum steering valve and a gas inlet. The inventive repaired chip has high quality.

Description

technical field [0001] The invention relates to a method for repairing an integrated circuit chip, and also relates to a printing steel plate specially used for the method. Background technique [0002] The method for repairing the chip is usually manual soldering. If it is a BGA (ball arranged in a grid) chip, the chip is repaired with a repair workbench. If the chip is caused by SMT (Surface Mount Technology) punching instead of bad raw materials, the chip will be ball-planted and then soldered on the repair workbench. However, due to the consideration of cost or product consistency in the design, the customer uses some special materials, which brings a lot of trouble in production and maintenance. [0003] figure 1 , figure 2 A chip used in a Palm model. figure 1 It is the physical picture of the BCM2002 BlueQ LCSP (ballless chip package) chip produced by Broadcom. figure 2 yes figure 1 Schematic representation of the features of the chip shown. The solder ball p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/60
CPCH01L2224/16225
Inventor 张习何代水
Owner YINGHUADA (SHANGHAI) ELECTRONIC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap