Ceramic welding mold for welding and packaging semiconductor chip and lead-out wire

Abstract

The invention relates to an improvement on the welding and packing ceramic mould between semi-conductor and lead-out wire, wherein it is characterized in that: it coats boron nitride on the surface of shaped / sintered silicon or silicon nitride at 51-100wt%, and the boron nitride at 0-49wt%. And the obtained welding module can be used in 600-950Deg. C high-temperature welding and packing. And the product will not deform in long time at high temperature, and the glass package will not adhere with glass.

Description

technical field [0001] The present invention is a follow-up improvement application to the Chinese patent 200410071751.9 previously applied by the applicant, and especially relates to a ceramic welding mold with a long service life, which is especially suitable for glass bulb packaging. Background technique [0002] In the Chinese patent 200410071751.9, the applicant discloses a semiconductor device in the electronics industry such as diodes, triodes, bridge stacks, etc., a chip and lead wire welding, and a packaging mold. Progress, for welding and plastic packaging with a temperature requirement of 300-500 ° C, it has a good use effect, greatly prolongs the service life, and greatly improves the welding yield. However, in actual use, it is found that the glass bulb packaging with higher temperature requirements, such as 600-950°C, will still cause the glass bulb and the mold to bond to each other, and the glass bulb will be damaged and scrapped when it is removed. So there...

AI Technical Summary

Problems solved by technology

However, in actual use, it is found that the glass bulb packaging with higher temperature requirements, such as 600-950°C, will still cause the glass bulb and the mold to bond to each other, and the glass bulb will be damaged and scrapped when it is removed.