Method for improving circuitboard welding quality and air knife device therefor

Abstract

This invention discloses a method for improving solder quality of CB and a device, in which, the method includes: spraying scaling powder on the CB, blowing the scaling powder on the lower surface of the CB in the through--ole of the CB to increase the coating volume of the powder in the through-hole and wash out the OSP coating of the hole wall to increase the solder ability of the hole, removing the scaling powder coated on the solder resistant film of the lower surface of the CB to reduce residual ions of the welded CB, preheating the CB welding the CB by a wave crest welder.

Description

technical field

[0001] The invention relates to the field of circuit board manufacturing, in particular to a circuit board welding technology. Background technique

[0002] With the strengthening of environmental protection requirements, more and more countries or regions require that electronic products sold in the country need to be lead-free. For this reason, in the production of electronic products, when using wave soldering to solder circuit boards, it is necessary to use environmentally friendly non-organic solvents. Now people usually use VOC-free (Volatility Organic Compound-free) flux. However, due to the high surface tension of the VOC-free flux, the sprayed VOC-free flux cannot effectively completely wet the through holes of the circuit board, especially for the circuit boards that are surface-treated by the OSP process, after soldering, the through holes The penetration height of the solder in it is very small, which cannot meet the requirements of soldering rel...

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