Workpiece processing system

A technology for workpieces and processing chambers, which is applied in washing and drying, surface treatment of workpieces, and cleaning fields. It can solve problems such as insufficient particle specifications, achieve stable wafer processing effects, reduce particle pollution, and improve production pass rate.

Inactive Publication Date: 2009-05-13
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing machinery is insufficient to meet future particle specifications

Method used

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  • Workpiece processing system
  • Workpiece processing system
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Examples

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Embodiment Construction

[0075] Description with reference to Figures 1 to 3

[0076] As shown in FIGS. 1-3 , processing system 10 has housing 15 , controller / display 17 , and input / output station 19 and a plurality of processing stations 14 . Workpieces 24 are removed from carriers 21 at input / output station 19 and processed within system 10 .

[0077] The processing system 10 includes a support structure for a plurality of processing stations 14 within an enclosure 15 . At least one handling station 14 includes a workpiece handling machine 16 and an actuator 13 for opening and closing the handling machine 16 . The processor 16 of the present invention is designed for use in processing systems 10, such as those filed on June 6, 2003, Application Nos. 691,688, and the processing system disclosed in co-pending US Patent Application No. 10 / 690,864, filed October 21, 2003. These US patent applications are hereby incorporated by reference. System 10 may include only a plurality of processors 16, or ma...

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PUM

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Abstract

A system for handling workpieces includes a handling head assembly and a base assembly. The treatment head assembly has a treatment head and an upper rotor. The base assembly has a base and a lower rotor. The base and the lower rotor have magnets, wherein the upper rotor can engage the lower rotor by magnetic force generated by the magnets. The joined upper and lower rotors form a processing chamber in which semiconductor wafers are positioned for processing. A treatment fluid for treating the workpiece is introduced into the treatment chamber, optionally as the treatment head rotates the workpiece. Additionally, airflow around and through the processing chamber is controlled to reduce particulate additions to the workpiece.

Description

technical field [0001] The present invention relates to the surface treatment, cleaning, rinsing and drying of workpieces, such as semiconductor wafers, flat panel displays, hard disk or optical media, thin film magnetic heads, or other workpieces formed from substrates on which microelectronic circuits, data storage elements or layers, or micromechanical components. These and similar articles are collectively referred to herein as wafers or workpieces. In particular, the present invention relates to a workpiece handler and system for processing semiconductor workpieces. Background technique [0002] The semiconductor manufacturing industry is constantly seeking to improve the processes and machinery used to fabricate microelectronic circuits and components, such as integrated circuits from wafers. The goals of most of these improved processing techniques and machinery include: reducing the time required to process wafers to form the desired integrated circuits; increasing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00B05C11/00
Inventor 凯尔·M·汉森埃里克·伦德科比·格罗夫史蒂文·L·皮斯保罗·Z·沃思斯科特·A·布鲁纳乔纳森·孔茨
Owner APPLIED MATERIALS INC
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