Thin film crystal-coated package structure with extended pin

Abstract

The present invention relates to a film crystal coating packaging structure with the extending pins, which mainly comprises a circuit film, a protruding block wafer and a point coating glue body. The circuit film is the crystal coating connecting area in a rectangle corresponding to the wafer with a soft dielectric layer, a plurality of long side pins and short side pins. A plurality of inner connecting parts for the long side pins and the short side pins are respectively arranged on the two long sides or two short sides of the crystal coating connecting area, wherein the long side pins have a plurality of prolonging pins, and the inner connecting part of the prolonging pins is the inner connecting part longer than the neighboring long side pins and extends towards the center of the crystal coating connecting area to prevent the falling of the soft dielectric layer when connecting the protruding block of the wafer, so the point coating glue body can smoothly be filled between the circuit film and the wafer without producing air bubble.

Description

technical field [0001] The present invention relates to an integrated circuit packaging structure, in particular to a device that can prevent the collapse of a soft dielectric layer when bonding bumps of a chip, so that the dispensing glue can be smoothly filled between the circuit film and the chip without A Chip-On-Film package with extended leads where air bubbles can occur. Background technique [0002] In the existing integrated circuit packaging structure in the past, a film-on-chip packaging structure is designed for a long rectangular display driver chip, and a gold bump is provided on the input end and the output end of the two long sides of the chip, respectively. And by applying pressing and heating, it is bonded to the pins of a circuit film. When the heating temperature of the wafer is transferred to the circuit film, the circuit film is often collapsed due to heat, resulting in deformation, making subsequent gluing difficult and reducing the yield. Especially...

AI Technical Summary

Problems solved by technology

[0009] Another object of the present invention is to provide a novel chip-on-chip packaging structure with extended leads, the technical problem to be solved is to make the extended leads on the different longer sides of the flip-chip bonding area be Arranged in a staggered manner, it can avoid the electrical short circuit between these extended pins and the interference of a little glue flow, so it is more suitable for practical use.

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