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Ceramic electronic component and method for manufacturing the same

A technology of electronic components and manufacturing methods, applied in the directions of printed circuit manufacturing, electrical components, circuits, etc., can solve problems such as difficulty in preventing, insufficient effect, disconnection of via conductors 108, 109, etc., to achieve stable electrical characteristics, improve density. The effect of cohesion and void prevention

Inactive Publication Date: 2009-07-08
KYOCERA CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, if the amount of inorganic particles contained in the conductive paste for via-hole conductors is large, the conduction resistance of the via-hole conductors 108 and 109 may increase, or the above-mentioned via-hole conductors 108 and 109 may be disconnected.
Therefore, the amount of inorganic particles contained in the conductive paste for via-hole conductors needs to be suppressed to a small amount. The effect of shifting the sintering start temperature of the paste to the high temperature side is insufficient, and the generation of voids G at the interface between the conductor layer 102 and the via conductors 108 and 109 cannot be effectively prevented. 1 such problem
[0014] That is, it is difficult to prevent the generation of voids G in the interface between the dielectric layer 102 and the via conductors 108 and 109 without increasing the amount of the conventional inorganic particles. 1

Method used

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  • Ceramic electronic component and method for manufacturing the same
  • Ceramic electronic component and method for manufacturing the same
  • Ceramic electronic component and method for manufacturing the same

Examples

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Embodiment Construction

[0035] figure 1 It is a cross-sectional view showing a multilayer ceramic capacitor 1 as an example of the ceramic electronic component of the present invention. refer to figure 1 , The multilayer ceramic capacitor 1 of this example includes a dielectric block 3 in which a plurality of dielectric layers 2 formed of ceramics are stacked.

[0036] Between the layers of the respective dielectric layers 2 forming the dielectric block 3 , internal electrodes 4 and 5 serving as conductor wiring are alternately arranged for each of the plurality of layers. In addition, the dielectric block 3 is formed with via conductors 8, 9 extending from the upper surface 6 shown in the drawing to the lower surface 7 of the dielectric block 3 through its stacking direction, and the upper surface 6 and the lower surface 7 of the dielectric block 3 are , external electrodes 10 electrically connected to via-hole conductors 8 and external electrodes 11 electrically connected to via-hole conductors...

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Abstract

The present invention relates to a ceramic electronic component and a manufacturing method thereof. A ceramic electronic component in which a via conductor is buried in a through-hole of a dielectric layer formed of a sintered body of ceramic particles by firing the non-reactive slurry. ADVANTAGE OF THE INVENTION According to this invention, the ceramic electronic component which does not produce a gap between a via-hole conductor and an internal electrode, but can be electrically connected favorably can be provided.

Description

technical field [0001] The present invention relates to a ceramic electronic component including a dielectric layer formed of a sintered body of ceramic particles and provided with a through hole, a via conductor embedded in the through hole of the dielectric layer, and a method for manufacturing the ceramic electronic component. Background technique [0002] In recent years, in multilayer ceramic capacitors and the like, especially ceramic electronic components having a laminated structure with two or more laminated dielectric layers, in order to reduce the equivalent series resistance or equivalent series Inductance, and the use of a structure in which the above-mentioned conductor wiring is electrically connected to a via conductor penetrating through the stacking direction of the ceramic electronic component is gradually increasing. [0003] Figure 9 It is a cross-sectional view showing an example of the multilayer ceramic capacitor 101 having the above structure. refe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/30H01B1/22
CPCH01G4/2325H05K1/092H05K3/4061H05K2201/0209
Inventor 佐藤恒
Owner KYOCERA CORP
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