Method for producing a multilayer printed wiring board

Abstract

A method for producing a multilayer printed wiring board includes an inner layer formation step of forming an inner layer pattern in a core substrate divided corresponding to a flexible portion that is made bendable and a hard portion that is made rigid, and an outer layer formation step of forming an outer layer such that an outer layer material that covers the core substrate is caused to make contact at the hard portion, and an outer layer pattern formation step of forming an outer layer pattern in the surface of the outer layer material, and a removal step of removing a covering portion that is the outer layer material and is covering the flexible portion, and an outer shape formation step of forming the outer shape of a layered substrate formed via the removal step. Also, an inner layer protection pattern is formed in the periphery of the flexible portion before the outer layer formation step, and the method is provided with a step of severing the periphery of the covering portion by irradiating a laser beam on the outer layer material that corresponds to the inner layer protection pattern before the removal step.

Description

technical field [0001] The invention relates to a method for manufacturing a multilayer printed circuit wiring board. Background technique [0002] The priority claimed by this application is based on Japanese Patent Application No. 2005-301840 filed on October 17, 2005 in Japan. All content is incorporated into this application to the extent referred to therein. [0003] The present invention relates to a method of manufacturing a multilayer printed circuit wiring board having a step of removing a part of outer layer material. [0004] In portable electronic devices such as camcorders and digital cameras, many electronic components are arranged in a small space inside, and since they must be connected by wiring, multilayer printed circuit boards that can be bent are used. Here, a method of manufacturing a bendable multilayer printed wiring board will be described with reference to the drawings. [0005] Figure 13 is a cross-sectional view of a core board in a convention...

AI Technical Summary

Problems solved by technology

[0016] However, although the cover part is in a state where the core board is not bonded with an adhesive, in the manufacturing process of the multilayer printed wiring board, heat and pressure are applied when the cover layer film and the outer layer material are laminated. , so the covering part is in a state of close contact with the core plate

Therefore, the covered part becomes difficult to peel off

[0017] In the conventional multilayer printed circuit board manufacturing method and the manufacturing method of Patent Document 1, because in the state after forming the shape, that is, the flexible part is in a cantilever state on the boundary with the hard part, it is easy to In the bent state, peel off the closely attached covering part, so when the peeling starts, the flexible part may be bent or deformed, or waves may be caused at the edge of the flexible part

In addition, due to the deformation of the flexible part, etc., stress is concentrated on the boundary with the hard part, resulting in damage to the boundary, so the bending resistance (resistance to repeated handling tests in a bent state) may decrease.

[0018] Also, for the same reason, even during peeling, the flexible portion is sometimes bent or deformed, or waviness is caused at the edge of the flexible portion, or the bending resistance is lowered.

[0019] Therefore, the stripping work must be done carefully and takes considerable time

[0020] In addition, since the covering part is peeled off after the outer shape is formed, and electrical inspection and other operations are performed, the chances of applying external force to the flexible part increase, and the flexible part may be damaged or bent.

[0021] In addition, in the case of forming direct plug-in terminals on the flexible part, if the terminals are damaged, bent, wrinkled, etc., the connection with the connector will often cause poor contact, so care must be taken not to cause such a problem. Damaged, bent, wrinkled, etc., it takes a considerable amount of operating time to perform peeling operations

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