Integrated processing technique for waste water in breadboard production

Abstract

The invention relates to a treatment process for effectively treating a large amount of waste water generated in the production of circuit boards, in particular to the pretreatment process and the entire waste water treatment process of high-copper waste water and high-COD refractory biodegradable waste water in the treatment process. Firstly, rationally classify the wastewater. According to the nature of the wastewater, it can be divided into gold-plating line cyanide wastewater, nickel wastewater, silver wastewater, copper wastewater, ink stripping and development wastewater, high COD wastewater and general washing water. The above seven wastewaters are collected separately. And for special treatment, the key technology lies in the pretreatment process for copper-based wastewater, ink stripping and developing wastewater and high COD wastewater. The key to the treatment of copper-based wastewater is to break the complex and prevent the secondary complexation of residual Cu2+ and EDTA in the process of adjusting the pH to alkaline; the key to stripping ink development wastewater and high COD wastewater is to remove the part by electrocatalytic oxidation On the basis of COD, to increase its BOD / COD ratio, fundamentally improve its biodegradability.

Description

technical field [0001] The invention relates to an environmentally friendly wastewater treatment process, in particular to wastewater classification, high Cu 2+ The key treatment process for wastewater and high-concentration biodegradable organic wastewater. Background technique [0002] With the rapid development of the electronic product production industry, the output and scale of circuit board production are increasing. Among them, the wastewater discharge of large and medium-sized professional production plants is about 1000T / D~20000T / D. The main pollutant of this kind of wastewater is Cu 2+ Mainly heavy metal ions and organic compounds that are difficult to biodegrade (BOD / COD<10%), while Cu 2+ Due to the existence of a large amount of EDTA (ethylenediaminetetraacetic acid) in the wastewater and in the form of complexes, the chemical stability is very high, which is completely different from the general electroplating wastewater. Many circuit board manufacturers ...

AI Technical Summary

Problems solved by technology

Many circuit board manufacturers have long been Cu 2+ and COD can not be discharged stably and meet the standards. There are far less treatment engineering specifications and monographs in this area than electroplating wastewater treatment.

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