Large power light-emitting diode

Abstract

This invention provides a large power LED including at least a LED chip and a metal base, in which, the top surface of the base is plated with an alumina layer and a metal conduction layer covers the top surface of it, and a high heat-conductive agglutinating laye or an eutectic layer is set between the chip and the alumina layer or the metal layer, which replaces traditional PCB with a non-conductive alumina layer and a metal layer covering it to reduce heat resistance and length of radiation channel.

Description

【Technical field】 [0001] The invention relates to a light-emitting device, in particular to a high-power light-emitting diode. 【Background technique】 [0002] The chips of high-power light-emitting diodes will generate a lot of heat when they work, causing the chip temperature to rise rapidly. Since the luminous efficiency and reliability of light-emitting diodes plummet with the rise of chip temperature, how to minimize thermal resistance and The heat generated by the chip can be effectively dissipated so that the light-emitting diode can work at a lower temperature, which is the key to the manufacture of high-power light-emitting diodes. [0003] The traditional packaging method of SMD (Surface Mount Device) light-emitting diodes is to directly fix the light-emitting diodes on the printed circuit board. Due to the poor heat dissipation efficiency of the printed circuit board, the heat generated by the light-emitting diodes cannot be dissipated in time. Therefore, the tradi...

AI Technical Summary

Problems solved by technology

[0003] The traditional packaging method of SMD (Surface Mount Device) light-emitting diodes is to directly fix the light-emitting diodes on the printed circuit board. Due to the poor heat dissipation efficiency of the printed circuit board, the heat generated by the light-emitting diodes cannot be dissipated in time. Therefore, the traditional The operating current of SMD light-emitting diodes is generally below 20 mA

[0004] In order to solve the problem that the working current of light-emitting diodes is difficult to increase due to the poor heat dissipation performance of the printed circuit board, as shown in Figure 1, some manufacturers have adopted the technical solution of opening a through hole on the printed circuit board 4 and filling it with a high thermal conductivity metal conductor 1 , the light emitting diode chip 2 is mounted on the high thermal conductivity metal conductor 1 through the silver glue 3, and the electrode of the light emitting diode chip is electrically connected with the printed circuit board 4 through the gold wire 5

Although metal conductors with high thermal conductivity enhance the heat dissipation of LEDs, due to the large thermal resistance of printed circuit boards, it is still unfavorable for the heat dissipation of LEDs, and it is difficult to significantly improve the power and luminous efficiency of LEDs.

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