Ceramic powder, electroconductive paste, multilayer ceramic electronic component, and method for production thereof

Abstract

As the ceramic powder for addition to the electroconductive paste fated to form intermal electrode layers in a multilayer ceramic electronic component resulting from alternately stacking the dielectric ceramic layers and internal electrode layers, a ceramic powder that possesses a perovskite-type crystal structure and satisfying the condition that the weight ratio Wt / Wc of the tetragonal phase content Wt and the cubic phase content Wc be less than 2 is used. The weight ratio Wt / Wc of the tetragonal phase and the cubic phase is determined by the polyphasic analysis in accordance with the Rietveld method. The ceramic powder is a barium titanate powder, for example.

Description

technical field [0001] The present invention relates to a ceramic powder added as a common material to an internal electrode layer in a laminated ceramic electronic component in which dielectric ceramic layers and internal electrode layers are alternately laminated, and more particularly to a ceramic powder for improving the insulation of a laminated ceramic electronic component. Furthermore, it is related with the electroconductive paste which used the said ceramic powder, a laminated ceramic electronic component, and its manufacturing method. Background technique [0002] For example, laminated ceramic capacitors, one of laminated ceramic electronic components, have a structure in which a plurality of dielectric ceramic layers and internal electrode layers are alternately laminated, and are widely used as small, large-capacity, and high-reliability electronic components. It is not uncommon to use multiple MLCCs in one electronic machine. [0003] In recent years, electron...

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Problems solved by technology

[0005] However, if the internal electrode layer is formed from the above-mentioned conductive paste for internal electrodes mainly composed of base metals such as Ni, for example, when the thickness of the dielectric ceramic layer is 10 μm or less, or the number of stacked layers is 100 or more, the thickness of the internal electrode layer will be reduced. Shrinkage, expansion, and the influence of the difference in the shrinkage behavior of the dielectric ceramic layer become significant, resulting in the occurrence of peeling (delamination) or cracks (structural defects), causing the problem of deterioration in manufacturing yield

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