MEMS automatic leading interlinking equipment based on zoom microscope location

A technology of wire bonding and microscopy, which is applied in the direction of microscopy, technology for producing decorative surface effects, microstructure technology, etc., can solve the problems of fatigue, time-consuming, unreliable and other problems of the staff

Inactive Publication Date: 2007-09-19
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of work, it is necessary to stare at the microscope for a long time for manual operation, and the staff are prone to fatigue, and

Method used

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  • MEMS automatic leading interlinking equipment based on zoom microscope location
  • MEMS automatic leading interlinking equipment based on zoom microscope location
  • MEMS automatic leading interlinking equipment based on zoom microscope location

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Embodiment Construction

[0022] The present invention is described in more detail below in conjunction with accompanying drawing example:

[0023] Combining with Figures 1-2, the composition of the MEMS automatic wire bonding equipment based on zoom microscope positioning includes a base 8, on which an X-axis workbench 9, a Y-axis workbench 7 and a microscope 2 are arranged, above the workbench A bonding head 10 is provided, and a liftable support 4 is provided on the base. The microscope is installed on the liftable support and a Z-axis stepping motor 3 is arranged on the microscope. An automatic magnification adjustment mechanism 6 is installed on the microscope. The face shield has a glass cover 5, and the microscope has a CMOS digital camera. Simultaneously in conjunction with Fig. 3, the magnification automatic adjustment mechanism is driven by a worm gear 13, a worm screw 14 meshed with a worm gear, a pulley 17 mounted on the worm screw, a synchronous belt 16 connected between the pulley and the...

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Abstract

The invention provides a MEMS automatic wire bonding apparatus based on zoom microscope positioning, comprising a base. The base is equipped with an X-axis workbench, a Y-axis workbench and a microscope, a bonding head is arranged above the workbench, a liftable support is arranged on the base, the microscope is mounted on the liftable support and provided with a Z-axis stepping motor, and an automatic magnification regulating mechanism is arranged on the microscope. The introduction of the continuous zooming microscope solves the vision positioning problem of the large visual field and high precision microscope, and the use of the image processing algorithm realizes the whole bonding operation automation and positively promotes the realization of batched MEMS wire bonding operation.

Description

(1) Technical field [0001] The invention relates to a wire bonding technology in the field of micro-electro-mechanical systems (MEMS), specifically utilizing a positioning method based on a zoom microscope to design an automatic wire-bonding device aimed at the characteristics of MEMS devices. (2) Background technology [0002] MEMS refers to micro-devices or micro-systems that can be produced in batches using micro-machining technology, integrating micro-sensors, micro-mechanisms, micro-actuators, signal processing and control circuits, interfaces, and communications. The development of MEMS technology has shown great vitality. Industrially developed countries attach great importance to the development of MEMS technology, regard it as a new economic growth point in the 21st century, and invest a lot of manpower and financial resources to promote the development and research of MEMS. In the industrialized processing of MEMS devices, wire bonding is the most mature and widely...

Claims

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Application Information

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IPC IPC(8): B81C1/00B81B7/00H01L21/60H01L23/48G02B21/00G02B21/36
CPCH01L2224/78H01L24/78H01L2924/00014H01L2224/48H01L2924/00012
Inventor 孙立宁陈立国马凌宇刘延杰
Owner HARBIN INST OF TECH
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