Enclosed infrared heating device for semiconductor chip

Abstract

The invention provides a closed infrared heater for semiconductor wafer, which includes an infrared generating chamber disposed at the inner of a shell having seal cover, a transmission window seal by transmission glass is arranged on one side of the shell, wherein, the two ends of the chamber respectively has lamp holders for mounting at least two lamps, and a reflection plate is disposed on one side of the lamps, and each lamp holder is mounted on the cover plate by insulation pillars and is connected to the power supply base, sub water inlets and sub water back ports arranged at the two ends of cooling water channel of each lamp holder are respectively connected to corresponding water back ports and water inlets of the water diversion bus, cooling water channel of the water diversion bus is connected to the same of the cover plate, and some cooling water channels of the shell are connected to the same of the cover plate, and air inlets and air outlets are respectively arranged on both sides of the shell. The invention is fit for radiation heating the movable wafer or fixed wafer of the semiconductor device, and has no pollution, can work in vacuum condition, and is fit for heating material such as silicon wafer which requires high cleanliness.

Description

technical field [0001] The present invention is semiconductor material processing equipment, and further refers to a closed infrared heating device for heating semiconductor wafers. Background technique [0002] Wafer heating on the semiconductor process line generally adopts non-contact radiation heating. In traditional heating devices, the heating lamp directly faces the wafer for heating. The lamp is not cooled. Due to poor heat dissipation, the temperature of the lamp holder and the surface of the lamp The rise is very high, causing high-temperature volatiles to affect the cleanliness of the system. The high temperature on the surface of the lamp tube softens the glass bulb of the lamp tube, which affects the life of the lamp tube, and the heating efficiency is not high. As the cleanliness requirements of semiconductor manufacturing process lines are getting higher and higher, wafer heating requires non-polluting heating methods and heating devices with high thermal effi...

AI Technical Summary

Problems solved by technology

[0002] Wafer heating on the semiconductor process line generally adopts non-contact radiation heating. In traditional heating devices, the heating lamp directly faces the wafer for heating. The lamp is not cooled. Due to poor heat dissipation, the temperature of the lamp holder and the surface of the lamp The rise is very high, causing high-temperature volatiles to affect the cleanliness of the system. The high temperature on the surface of the lamp tube softens the glass bulb of the lamp tube, which affects the life of the lamp tube, and the heating efficiency is not high.

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