A design method for compact and lamination structure microstrip antenna integrated with the receiving and sending functions
A technology of laminated structure and design method, which is applied in the direction of antenna, radiating element structure, electrical components, etc., can solve the problem of low transmit-receive isolation of transceiver integrated antenna, low antenna gain of elevation angle and poor axial ratio performance, and is not suitable for portable terminals and other problems, to achieve the effect of minimizing the radiation area of the antenna, improving the isolation of transceivers, and reducing the complexity of the structure
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[0024] The structure of the antenna is shown in Figure 1 and Figure 2. The receiving antenna radiator 1 and the transmitting antenna radiator 3 are respectively located on the front surfaces of the dielectric substrate 8 and the dielectric substrate 9 . The signal received by the receiving antenna is fed to the feeding network through the feeding probe 5 . The signal emitted by the radiating antenna is fed from the feeding network to the radiator 3 of the radiating antenna via the feeding probe 2 .
[0025] Figure 3 is a top view of the feed network. The 3dB coupler used in double-feed uses commercial chips.
[0026] Explanation of each label:
[0027] 1 receiving antenna; 2 transmitting antenna feeding probe; 3 transmitting antenna; 4 public floor; 5 receiving antenna feeding probe; 6 metallized through hole; 7 feeding network; 8 dielectric substrate; 9 dielectric substrate; 10 dielectric substrate ; 11 feed microstrip line; 12 feed microstrip line; 13 via hole; 14 ground;...
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