Composite laminated board high temperature resistant adhesive and preparation method thereof

Abstract

The invention discloses a high-temperature resistant adhesive for composite press-accumulate plate, introducing a multi-curing system with a curing agent of carboxyl terminated polyester into a curing system containing epoxy resin and phenolic resin. The adhesive comprises15-60 wt% epoxy, 0-15 wt% phthalic anhydride, 1-40 wt% carboxyl terminal group or anhydride polyester, 5-60 wt% phenolic resin, 0.1-6 wt% imidazoline, 1-40 wt% tung oil anhydride, l0-8 wt% 2,6-di-tert-butylpheno and 0-60 wt% silicon powder. The invention provides a simple preparation method, wherein the curing system is provided with good adhesion, waterproofness, isolation, and heat-resistance by optimizing the material. The adhesive can be widely used for insulating copper clad laminate and transformer core plate as well as the compositing and laminating of materials and the preparation of special FRP.

Description

technical field [0001] The invention relates to an adhesive material, more specifically, the invention relates to a high temperature resistant adhesive for composite laminates, and further relates to a preparation method of the high temperature resistant adhesive for composite laminates. Background technique [0002] In recent years, with the development of the electronics industry, the miniaturization of equipment, multi-layer, high-density, and miniaturization of circuits has also developed rapidly, and the frequency of electromagnetic waves for line transmission can reach GHz or MHz. It can be seen from the signal propagation speed V=C / ε1 / 2 (where C is the speed of light, ε is the relative permittivity) formula, the smaller the ε, the faster the signal propagation speed; the signal propagation loss from the circuit α=Ktgα×f (where K is a constant, and f is the propagation frequency) It can be seen from the formula that under the condition of constant dielectric loss, the ...

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Problems solved by technology

[0005] (1) In the patent [CN1477172], alkali is used as a catalyst to prepare a high-temperature-resistant silicone adhesive. Although the adhesive has good high-temperature resistance, its insulation performance will increase due to its dielectric constant due to the action of the catalyst. Big but low.. and use toluene as a solvent, polluting the environment

[0006] (2) In the patent [CN1065672], traditional phenolic resins are used to react with Diels-Alder adducts formed by the reaction of perhalogenated cyclic conjugated dienes and ethylenically unsaturated dienophiles with a vinyl content exceeding 50%. Raw material reaction. Due to the existence of unsaturated bonds, there will be a large shrinkage energy during the crosslinking process, which will greatly affect the mechanical properties of the material, and the adhesion will be low.

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