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Method of manufacturing a composite of copper and resin

A manufacturing method and composite technology, which can be used in semiconductor/solid-state device manufacturing, printed circuit manufacturing, multilayer circuit manufacturing, etc., can solve problems such as reduced adhesion and reduced reliability of semiconductor substrates, and can prevent haloing. , good adhesion and conductivity

Inactive Publication Date: 2008-03-19
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the copper oxide film on the bottom of the via hole is treated with sulfuric acid aqueous solution, etc., but depending on the type of resin in the insulating layer, this may cause halos similar to those in printed wiring boards
Occurrence of the halo leads to a problem of reduced adhesion, and a problem of reduced reliability of the semiconductor substrate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] The aqueous phosphoric acid solution of the present invention is prepared as follows. The pH of the obtained phosphoric acid aqueous solution was 2.1.

[0027] Component: content

[0028] Phosphoric acid (85%): 25.35g / L

[0029] Sodium hydroxide aqueous solution: 3.53g / L (calculated as sodium hydroxide)

[0030] Surfactant 1: 5.25g / L

[0031] Surfactant 2: 0.75g / L

[0032] Deionized water: balance

[0033] *Surfactant 1:

[0034] Nona 1912A (polyoxyalkylene aryl phenyl ether) manufactured by Toa Chemical Industries

[0035] *Surfactant 2:

[0036] LAOL XA-60-50 (polyethylene glycol nonyldecylundecyl ether) manufactured by Lion Corporation

[0037] The cleaning treatment was performed by immersing the above-mentioned test panels in an aqueous phosphoric acid solution at 23° C. for 1 minute or 5 minutes. The test panels were washed in water and dried with nitrogen, then the presence of halos was determined by observation with a microscope. The widths of the observ...

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PUM

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Abstract

A metallic copper and resin composite body manufacturing method of forming a copper wiring layer that forms an inner layer circuit, establishing an insulating layer with a resin on said wiring layer, forming via holes which expose the copper surface under the insulative layer, and depositing a metal on the copper surface that is exposed at the bottom of the via holes. The method includes a step of: removing copper oxide which forms on the surface of the copper that is exposed in the bottom of the via holes using a phosphoric acid aqueous solution with a pH between 1 and 3. The method suppresses haloing is and via holes with excellent solder bonding are formed.

Description

technical field [0001] The present invention relates to a manufacturing method of a composite body having a copper metal layer and an insulating layer on the surface, in particular, to a manufacturing method of a semiconductor substrate having a copper wiring layer (copy wiring layer) on the surface and a cleaning method thereof. Background technique [0002] In the field of electronic materials such as multilayer wiring boards and semiconductor devices, there is a need to reduce the size of semiconductor substrates and printed wiring boards used in electronic devices that are becoming smaller and smaller. In order to meet these demands, printed wiring boards and semiconductor substrates are made denser by making their circuits more complicated and multilayered. A known method for increasing wiring density is to form an insulating layer on the surface of a substrate forming an inner layer circuit, form holes in the insulating layer, and deposit metal in these holes to form c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768H01L21/48H01L21/3213H05K3/46H05K3/38
CPCH05K2203/0315H05K3/421H05K2203/1157H05K2203/0789H05K3/0055H05K3/38H05K3/46
Inventor 近藤正树
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC