Method for forming solder pad of semiconductor device

Abstract

A bonding pad forming method for semiconductor device comprises that: a current conducting layer is formed on a substrate of a semiconductor device; a bonding pad graph is etched on the current conducting layer; lattice defect detection is executed to the surface of the current conducting layer; diluted sulfur peroxide is utilized to process the lattice defects of the current conducting layer surface to form a bonding pad. The use of diluted sulfur peroxide which is a water-containing solution can remove the lattice defects of the bonding pad surface and simultaneously reduce the processing time of organic solvents, so as to improve productivity.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for forming pads of semiconductor devices. Background technique [0002] As a receiving component that forms a connection between a semiconductor device and other semiconductor devices or electronic components to form an electronic circuit module, the pad is required to have good conductivity and high reliability, and plays an important role in the internal structure of the semiconductor device. Optimizing the manufacturing process has always been the goal pursued by device structure engineers. [0003] Fig. 1 is a schematic diagram illustrating the method for forming a semiconductor device surface pad in the prior art. As shown in Fig. 1, in actual production, the common pad formation process of a semiconductor device includes: forming a conductive layer on the device substrate; Coating a photoresist layer on the layer; etching the conductive layer ...

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Problems solved by technology

[0007] Using the above method, although the lattice defects on the surface of the pad are removed during the process of forming the pad, the required organic solvent treatment time is too long, which limits the increase in production capacity. Therefore, how to apply it in the process of pad formation The organic solvent removal method removes the lattice defects on the pad surface while reducing the processing time has become the main problem faced by those skilled in the art at this stage

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