Chip and its making method

Abstract

The semiconductor component comprises at least coupling member whose maximal diameter is less than 100 micron and one lug bulge. The coupling member is located on the driving surface. The bulge is located on the coupling member in order to make the coupling member to electrically connect to the driving surface. The bulge comprises a cylinder part and a top part; the cylinder part is located on the coupling member; the top part is located on the top of the cylinder part; the cylinder part has a first diameter length and a second diameter length parallel to the driving surface; the first diameter length is 1.2 times longer than the second diameter length.

Description

technical field [0001] The present invention relates to a semiconductor element and its manufacturing method, and in particular to a standard fine-pitch semiconductor element and its manufacturing method. Background technique [0002] Modern technology is changing with each passing day, and various electronic products are constantly being introduced. With the widespread use of electronic products in daily life, the demand for semiconductor components is increasing day by day. As the design of semiconductor components is becoming lighter and thinner, when the size of semiconductor components shrinks, the number of I / Os increases instead of decreasing, which reduces the line pitch (Pitch) and line width. In order to solve this problem, the industry has developed a standard fine pitch (FinePitch) technology. [0003] Please refer to Figures 1 to 3 at the same time. 1-2 are schematic side views of a conventional semiconductor device 900 , and FIG. 3 is a top view of the semic...

AI Technical Summary

Problems solved by technology

[0005] However, during the process of assembling the semiconductor element 900 on the flip-chip mounting board, actions such as moving or alignment may easily cause the cylindrical bump 920 to bend (as shown in the rightmost bump in FIG. 1 and FIG. 2 ).

This makes it impossible for semiconductor components to be well assembled on flip-chip mounting boards, and even forms a short circuit, which affects the electrical function of the packaging structure

[0006] The above defective semiconductor element 900 is difficult to rework and repair, and must be disposed of as scrap

Even if defective semiconductor elements 900 can be reworked, expensive rework costs must be spent, which is quite wasteful

Therefore, a multi-channel defective product monitoring system is currently used in the process to avoid defective products from flowing into the next process and causing greater losses

However, this move must also result in an increase in process management costs

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